Wafer Separation Trenches With Sidewall Lining And Void Volume
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Solution Overview
Problem
The existing methods for separating electronic components from a wafer are inefficient and prone to damage, with mechanical or laser cutting processes being cumbersome and potentially damaging to the components.
Innovation Solution
A method involving a separation frame with integrated separation trenches, partially lined with a sidewall lining and closed with a structure to maintain a void volume, which defines a breaking point for efficient and reliable separation of electronic components, reducing the risk of contamination and damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If mechanical or laser cutting is used to separate electronic components from the wafer, then the separation process can be completed, but the electronic components may be damaged and the process becomes cumbersome
Solution Approach 1:
The patent applies preliminary action by forming separation trenches and applying sidewall lining to protect the separation interfaces before the actual separation process. The trenches are created and lined in advance, preparing predetermined breaking points that guide the separation process and prevent damage to electronic components during wafer singulation
Solution Approach 2:
The sidewall lining acts as an intermediary material between the separation trench walls and the electronic components. This lining material protects the trench walls from contamination and prevents direct contact between the cutting/separation process and the electronic component sidewalls, thereby maintaining component integrity while enabling efficient separation
2Reliability
If separation trenches are formed in the separation frame, then the separation process becomes more reliable, but the device complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the separation frame into distinct regions with separation trenches created between adjacent electronic components. These trenches segment the wafer structure at predetermined locations, creating controlled breaking points that improve separation reliability while maintaining a relatively simple overall structure that can be integrated into standard wafer fabrication processes
3Reliability
If sidewall lining is applied to protect from contamination, then component quality is maintained, but manufacturing effort increases
Solution Approach 1:
The patent applies local quality by selectively applying sidewall lining only to the specific regions where contamination protection is needed - namely the separation trench walls adjacent to electronic components. This targeted approach maintains component quality by protecting critical interfaces while avoiding unnecessary manufacturing steps in non-critical areas, thus balancing quality assurance with manufacturing simplicity
Data Source
AI summary
A method of processing a wafer is disclosed. In one example, the method comprises providing the wafer with a separation frame separating neighboured electronic components, forming separation trenches in the separation frame and at least partially lining sidewalls of the separation trenches with a sidewall lining for partially filling the separation trenches while maintaining a void volume therein. An exterior opening of the separation trenches is closed by a closing structure.