Wafer Separator with Diagonal Shock-Absorbing Pieces
Solution Overview
Problem
Existing methods for transporting semiconductor wafers using conveyance containers face challenges such as wafer damage from vibration and impact, contamination risks due to contact with interlayer sheets, and issues with dust and outgassing from cushions, which are not fully addressed by current solutions.
Innovation Solution
A separator is introduced that is a flat annular body with an annular convex portion and cutout portions, featuring shock-absorbing function pieces extending diagonally, which interposes between semiconductor wafers and the container surfaces to absorb shocks and prevent contact, thus eliminating the need for cushions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If cushions are arranged on the uppermost stage and lowermost stage in the container to reduce damage of semiconductor wafers due to vibration and impact, then wafer protection is improved, but dust and outgas are generated from the cushions
Solution Approach 1:
The patent removes the cushion component entirely from the wafer transport system. Instead of using cushions that generate dust and outgas, the invention uses a container design with recessed portions and protruding portions that provide mechanical protection without contact materials, thereby eliminating the harmful emissions while maintaining wafer protection
Solution Approach 2:
The patent introduces an intermediary structural mechanism between the wafer and the container walls. The recessed portions and protruding portions act as intermediaries that absorb and distribute impact forces during transport, protecting wafers from vibration and impact without requiring cushioning materials that generate contamination
2Reliability
If interlayer sheets are placed between wafers to reduce damage, then wafer protection is improved, but contamination risk increases due to contact between wafer surface and interlayer sheet
Solution Approach 1:
The patent removes the interlayer sheet component from between wafers. By using a vertical stacking arrangement with recessed portions in the container, wafers are held separately without requiring interlayer sheets, thereby eliminating the contamination risk while maintaining protection against damage
Solution Approach 2:
The patent transitions from horizontal wafer arrangement with interlayer sheets to vertical stacking arrangement. This dimensional change allows wafers to be stacked vertically with gaps maintained by the recessed portions, eliminating the need for interlayer sheets and preventing contamination while still providing mechanical support
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents wafer damage from vibration and impact without using cushions, reduces contamination risks, and facilitates easy storage and removal of wafers, while maintaining a non-contact state for sensitive structures.
Implementation Method 1
the separator has shock-absorbing function pieces neighboring to the cutout portions and extending diagonally upward or diagonally downward relative to a separator reference plane
Data Source
Figure 1(A)~1(D3)
Figure 2
Figure 3(A)~3(D3)
AI summary
Disclosed is a separator for semiconductor wafers vertically stacked in that the stacked wafers do not contact with each other, or the wafer does not contact to an inner top surface or an inner bottom surface of a conveyance container of the semiconductor wafer, the separator being interposed between two of the wafers neighboring vertically, between the wafer and an inner top surface, or between the wafer and an inner bottom surface of the container. The separator includes: a flat annular body; an annular convex portion having a wafer support surface coming into contact with a peripheral line of the wafer along a peripheral edge portion of the flat annular body, the annular convex portion forming cutout portions in a suitable number of places; and shock-absorbing function pieces neighboring to the cutout portions and extending diagonally upward or diagonally downward from a separator reference plane.