Wafer Separator Ring Structure for ESD and Contact Damage Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional injection-molded trays for handling and transporting semiconductor wafers often cause physical damage and electrostatic discharge due to direct contact and inadequate static electricity dissipation, leading to increased transport costs and manufacturing inefficiencies.
Innovation Solution
The design of semiconductor wafer separators with a first right-angled recess to minimize contact and a second recess to create a gap beneath the wafer, reducing physical damage and electrostatic discharge risks, while interlock components facilitate efficient stacking and handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional injection-molded trays maintain physical contact with semiconductor wafers to restrict movement, then the wafers are secured during transport, but the wafers are susceptible to physical damage from external forces applied to the tray
Solution Approach 1:
The patent introduces an intermediary component (the separator) between the tray and the wafer. This separator absorbs external forces and prevents direct transmission to the wafer, thereby protecting the wafer from physical damage while still maintaining secure positioning during transport.
Solution Approach 2:
The separator acts as a pre-positioned cushioning element that anticipates and absorbs external forces before they can reach the wafer. By placing this protective barrier in advance, the wafer is protected from impact and mechanical stress during handling and transport.
2Reliability
If conventional injection-molded trays maintain direct contact with semiconductor wafers, then the wafers are restrained during transport, but static electricity cannot be properly dissipated leading to ESD damage
Solution Approach 1:
The separator serves as an intermediary that interrupts the direct contact path between the tray and the wafer. This breaks the electrostatic discharge pathway, preventing ESD from reaching the sensitive wafer while still allowing the tray to restrain the wafer's movement.
3Reliability
If conventional trays use extensive contact surfaces to secure wafers, then movement is restricted, but the complexity of the tray design increases
Solution Approach 1:
The solution segments the contact function into two distinct components: the tray provides the primary restraint structure, while the separator provides the protective interface. This segmentation allows each component to be simpler in design while collectively achieving both security and protection.
Data Source
AI summary
Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.