Wafer Sheet Fixing with Pre-Bond Foreign Matter Detection

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Solution Overview

Problem

Existing sheet fixing apparatuses risk fixing sheets to wafers with foreign matter attached, leading to potential damage during processing due to local stresses.

Innovation Solution

A sheet fixing apparatus with image capturing and foreign matter removing units to detect and remove foreign matter before fixing the sheet to the wafer, using cameras to inspect the surface and a controller to manage the process, along with a foreign matter removing unit to clean the surface and sheet.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a sheet is fixed to a wafer using a conventional sheet fixing apparatus, then the sheet can be securely attached to the wafer surface, but foreign matter may be sandwiched between the sheet and wafer causing local stresses and potential damage during subsequent processing

Engineering Contradiction:
Improvesheet fixation reliabilityVSAvoidforeign matter contamination
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The system performs image capture and foreign matter detection before the sheet fixing operation. The controller determines whether foreign matter is attached to the target surface by analyzing images captured by the image capturing unit, and only proceeds with sheet fixing when the surface is confirmed clean, preventing foreign matter entrapment before it can cause damage

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system uses image capture feedback to monitor the target surface condition. The controller receives image data from the image capturing unit, analyzes it for foreign matter presence, and based on this feedback, decides whether to proceed with sheet fixing or trigger foreign matter removal operations

Inventive Principle:
Principle #23Feedback

2Reliability

If foreign matter is detected on the target surface, then the sheet fixing process can be prevented or corrected, but additional inspection and cleaning steps increase process time and complexity

Engineering Contradiction:
Improvewafer processing reliabilityVSAvoidsheet fixing apparatus complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The image capturing unit serves multiple functions: it captures images for foreign matter detection, monitors the target surface condition, and provides feedback to the controller. This multi-functional approach allows the system to perform inspection and monitoring with a single integrated component rather than requiring separate dedicated sensors

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The system automatically detects foreign matter and triggers removal operations without requiring manual inspection or intervention. The controller autonomously manages the entire process from image capture to foreign matter removal, reducing the need for complex external monitoring systems

Inventive Principle:
Principle #25Self-service

3Reliability

If foreign matter is detected on the target surface, then corrective action can be taken before sheet fixing, but the inspection and removal processes add time to the manufacturing cycle

Engineering Contradiction:
Improvesheet-to-wafer bonding qualityVSAvoidwafer processing throughput
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The system performs foreign matter detection and removal operations before the sheet fixing step, ensuring that any contamination is addressed in advance. This preliminary action prevents defective bonding that would require rework, ultimately maintaining productivity by avoiding downstream failures

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system rapidly captures images and processes the data to quickly determine foreign matter presence. By speeding up the inspection and removal process, the system minimizes the time added to the manufacturing cycle while still ensuring reliable sheet-to-wafer bonding

Inventive Principle:
Principle #21Skipping (Rushing through)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Prevents sheets from being fixed to wafers with foreign matter, reducing the risk of damage and ensuring a clean interface for subsequent processing.

Implementation Method 1

an image capturing unit having a first camera for capturing images of the target surface before a sheet is fixed thereto

Methodology Applied
Scientific EffectLight reflection/detection: Reflection

Data Source

PatentUS20250327757A1Sheet fixing apparatus and method of manufacturing combination of workpiece and sheet fixed thereto
Publication Date: 2025.10.23 DISCO CORP
  • US20250327757A1 patent drawing
  • US20250327757A1 patent drawing
  • US20250327757A1 patent drawing

AI summary

A sheet fixing apparatus includes an image capturing unit having a first camera for capturing images of a target surface of a workpiece before a sheet is fixed to the target surface and a controller for controlling the image capturing unit. The controller determines whether the foreign matter is attached to the target surface or not on the basis of a first image captured of the target surface by the first camera by controlling the image capturing unit to capture the first image before the sheet is fixed to the target surface.