Wafer Expanding Sheet Cooling for Reliable Chip Separation
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Solution Overview
Problem
Existing expanding devices face challenges in reliably cooling and expanding extensible sheet members with semiconductor chips, as the adhesive layer does not harden at high cooling temperatures, leading to incomplete division, and becomes too hard at low temperatures, causing sheet member breakage.
Innovation Solution
An expanding device with a cooler that cools the sheet member and film to a temperature where the film becomes harder than the sheet member, allowing for precise division and minimizing sheet member breakage, while also considering variations in material hardness with temperature to optimize the cooling process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the cooling temperature is high, then the sheet member remains soft and expandable, but the adhesive layer does not harden and reliable division cannot be achieved
Solution Approach 1:
The patent applies parameter changes by cooling the sheet member to a specific temperature range where the adhesive layer hardens while the sheet member remains sufficiently soft for expansion. This temperature parameter optimization resolves the contradiction between maintaining sheet member expandability and achieving adhesive layer hardening for reliable division.
2Manufacturing precision
If the cooling temperature is low, then the adhesive layer hardens for reliable division, but the sheet member becomes too hard and cannot be expanded
Solution Approach 1:
The patent optimizes the cooling temperature parameter to a specific range that balances the hardness requirements of both the adhesive layer and sheet member. By precisely controlling this temperature parameter, the adhesive layer hardens sufficiently for reliable division while the sheet member maintains adequate softness for expansion operations.
3Reliability
If the sheet member is cooled to achieve film hardening, then division reliability improves, but sheet member breakage risk increases
Solution Approach 1:
The patent applies parameter changes by optimizing the cooling temperature to a specific range where the film hardens sufficiently for reliable division while the sheet member does not become excessively hard and brittle. This balanced temperature parameter simultaneously improves division reliability and prevents sheet member breakage during expansion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the yield of wafer division by ensuring the film is reliably divided with the sheet member, reducing breakage and improving the expansion process, even with varying material hardness conditions.
Implementation Method 1
a cooler configured to cool an extensible sheet member on which a wafer including a plurality of semiconductor chips is arranged and a film provided on the wafer to a cooling temperature at which the film becomes harder than the sheet member
Data Source
AI summary
An expanding device includes a cool air supplier and a cooling unit configured to cool an extensible sheet member on which a wafer including a plurality of semiconductor chips is arranged and a film provided on the wafer to a cooling temperature at which the film becomes harder than the sheet member. The expanding device further includes an expander configured to expand the sheet member cooled to the cooling temperature by the cool air supplier and the cooling unit to divide the wafer into the plurality of semiconductor chips.