Wafer Shelf Conduction Path for Static Charge Dissipation

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Solution Overview

Problem

During semiconductor wafer processing, accumulated charge on wafers can lead to adverse effects such as reduced yield and unpredictable device performance, increasing costs due to undesired semiconductor device outcomes.

Innovation Solution

A semiconductor wafer storing apparatus with a wafer carrier and stocker system that includes conductors and current controllers to manage charge flow, allowing charge dissipation from the wafer to the stocker or handling system, thereby reducing the charge on the wafer and mitigating adverse effects during subsequent fabrication processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If wafers are stored in a wafer carrier during transport and processing, then wafer mobility and storage capacity are improved, but charge accumulates on the wafer surface leading to reduced yield and unpredictable device performance

Engineering Contradiction:
Improvewafer storage and transport capabilityVSAvoiddevice performance predictability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

A conductive member is introduced as an intermediary between the wafer and the wafer carrier. This conductive member acts as a charge transfer medium, allowing accumulated charge to be dissipated from the wafer surface to the wafer carrier, thereby preventing charge-related defects while maintaining the wafer storage and transport function

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The harmful accumulated charge is extracted from the wafer surface through the conductive member. By providing a charge dissipation path, the unwanted charge buildup is removed, preventing its adverse effects on device performance while preserving the beneficial wafer handling capabilities

Inventive Principle:
Principle #2Taking out (Extraction)

2Ease of operation

If charge accumulates on semiconductor wafers during processing, then wafer handling and storage become simpler, but adverse effects occur including reduced yield and increased costs

Engineering Contradiction:
Improvewafer handling simplicityVSAvoidcharge accumulation effects
Core Design Contradiction:
Ease of operationVSObject-generated harmful factors

Solution Approach 1:

The conductive member serves as a mediator that enables charge dissipation without complicating the wafer handling system. It provides a passive charge management solution that maintains operational simplicity while eliminating harmful charge accumulation effects

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The conductive member converts the potentially harmful charge accumulation into a beneficial charge dissipation mechanism. By providing a controlled path for charge flow, the system transforms what would be a harmful effect into a protective function that improves wafer quality

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively reduces adverse effects on semiconductor wafers by dissipating excess charge, increasing wafer yield and improving semiconductor device performance while reducing costs.

Implementation Method 1

A semiconductor wafer storing apparatus includes a wafer carrier having a wafer shelf, a stocker housing the wafer carrier, a conductor providing a conductive path, and a current controller

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS11901207B2Semiconductor wafer processing system and method
Publication Date: 2024.02.13 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US11901207B2 patent drawing
  • US11901207B2 patent drawing
  • US11901207B2 patent drawing

AI summary

A semiconductor wafer processing system includes a stocker having an interior surface, a wafer carrier disposed within the stocker, a wafer shelf disposed within the wafer carrier for storing a semiconductor wafer, and a discharge circuit including a first conductor electrically coupled to the wafer shelf and a first current controller electrically coupled to the first conductor and to the interior surface of the stocker.