Semiconductor Wafer Singulation Using Temperature-Dependent Tape
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Solution Overview
Problem
Conventional methods for manufacturing light emitting elements face inefficiencies due to unexpected chipping or breakage during the cleavage process, leading to increased time and labor in addressing these issues.
Innovation Solution
A method involving the temporary fixation of a semiconductor wafer to a support base member using a double-sided tape with a loss tangent that increases with heating, allowing for the formation of a cleavage starting portion at ordinary temperature and subsequent singulation of the wafer into light emitting elements while the tape is heated, reducing the risk of breakage and improving work efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a wafer is supported on a dicing sheet during cleavage, then the wafer can be held stable, but unexpected chipping or breakage occurs during the manufacturing process
Solution Approach 1:
The patent changes the physical state of the double-sided tape from a rigid state at ordinary temperature to a softened state at elevated temperature. By controlling the temperature parameter, the tape transitions between providing strong support and allowing easy separation, resolving the contradiction between maintaining wafer integrity during cleavage and enabling efficient chip removal afterward
Solution Approach 2:
The patent introduces a dynamic support system where the double-sided tape changes its mechanical properties based on temperature. The tape is soft and flexible during wafer handling and cleavage, then becomes easy to separate after heating, creating a dynamic adaptation to different process requirements rather than a static support structure
2Ease of manufacture
If a double-sided tape with increased loss tangent by heating is used for temporary fixation, then the wafer can be easily singulated, but additional heating equipment and process control are required
Solution Approach 1:
The double-sided tape performs dual functions: it provides strong adhesion during cleavage and then self-separates after heating. The material's inherent temperature-dependent properties enable it to serve both as a strong bond and a release mechanism, reducing the need for additional complex release systems or manual intervention
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances work efficiency by facilitating easier cleavage of the wafer and reducing defects, thereby improving the overall productivity and reducing the discarded area of the wafer.
Implementation Method 1
a double-sided tape having a loss tangent adapted to be increased by heating from an ordinary temperature
Data Source
AI summary
The method of manufacturing a light emitting element includes: temporarily fixing a semiconductor layer of a wafer including a base member and the semiconductor layer to a support base member by a double-sided tape having a loss tangent adapted to be increased by heating from an ordinary temperature; forming a cleavage starting portion for dividing the wafer into a plurality of light emitting elements at an ordinary temperature in the wafer; and singulating the wafer into a plurality of light emitting elements on the support base member while the double-sided tape is heated.