Wafer Singulation Overlay Removal Using Blade and Vacuum Nozzles
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Solution Overview
Problem
Existing methods for exposing bond pads on semiconductor wafers, particularly in microelectromechanical systems (MEMS) devices, are inefficient and labor-intensive, as they fail to automate the removal of interposers and glass wafers that obstruct access to these pads, leading to low yield and high costs.
Innovation Solution
A semiconductor wafer prober device (SWPD) with a blade and vacuum nozzles is used to automate the dislodging and removal of obstructing members, enabling precise exposure of bond pads by translating the blade and using vacuum to remove dislodged materials, improving yield and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual methods are used to remove interposers and glass wafers, then labor flexibility is maintained, but productivity is low and manufacturing precision is poor
Solution Approach 1:
The system uses vacuum nozzles to automatically capture and remove dislodged interposers and glass wafer fragments without requiring manual intervention between blade strokes, enabling continuous automated operation
Solution Approach 2:
The blade and vacuum nozzle are integrated into a single automated toolhead that performs both dislodging and removal functions in sequence, combining multiple operations into one automated system
2Manufacturing precision
If automated blade and vacuum systems are used, then productivity and precision are improved, but device complexity increases
Solution Approach 1:
The toolhead is divided into modular components including the blade mechanism, vacuum nozzle array, and control system, allowing for precise positioning and independent optimization of each subsystem
Solution Approach 2:
Manual mechanical removal operations are replaced with an automated blade-dislodge-and-vacuum-remove system controlled by computer programming, eliminating manual labor and improving consistency
3Ease of manufacture
If multiple vertical orifice triads are formed, then bond pad exposure is enabled, but manufacturing complexity increases
Solution Approach 1:
Multiple vertical orifice triads are pre-formed in the wafer structure before the probing operation, creating ready-made access pathways that simplify the subsequent automated removal and exposure process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The SWPD enhances manufacturing precision, speed, and reduces costs by automating the process, leading to improved yield and reduced labor expenses, while ensuring consistent and repeatable bond pad exposure for semiconductor package assembly.
Implementation Method 1
removing the first member using a vacuum, inserting the blade of the wafer prober device in a second vertical orifice of the second vertical orifice triad, dislodging the second member of the assembly using the blade to expose a second bond pad, removing the second member using the vacuum
Data Source
AI summary
In some examples, a device comprises a wafer chuck, a member having a surface facing the wafer chuck, a blade supported by the surface, a first vacuum nozzle extending through the member and having a first vacuum orifice facing a same direction as the surface, and a second vacuum nozzle extending through the member and having a second vacuum orifice facing the same direction as the surface. The first and second vacuum orifices are on opposing sides of the blade.