Wafer-Sized Module Plate for Parallel IC Testing
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Solution Overview
Problem
Current module test systems require separate module boards and sockets for testing integrated circuit modules, which is inefficient and not scalable for parallel or sequential testing of multiple modules.
Innovation Solution
A module plate with a diameter equivalent to an integrated circuit wafer and a height that accommodates module lids, featuring cutouts that support modules on all four sides or fewer, allowing for parallel or sequential testing using repurposed integrated circuit wafer testing equipment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate module boards and sockets are used for testing, then module testing can be performed, but the system complexity increases and scalability for parallel testing is limited
Solution Approach 1:
The module plate is designed to be compatible with existing wafer probe testing equipment, allowing the same equipment to test both wafers and modules. The plate features a standard outer diameter that fits wafer probe equipment and includes multiple recesses that can accommodate different module configurations, enabling one testing system to serve multiple purposes without requiring separate specialized equipment for modules.
Solution Approach 2:
The invention combines multiple modules onto a single module plate that resembles a wafer in size and handling characteristics. By integrating several modules on one plate with a standard outer diameter, the system can test multiple modules simultaneously using the existing wafer probe equipment, merging the functionality of testing multiple individual modules into a single unified platform.
2Ease of operation
If separate module boards are used for each module, then individual module testing is enabled, but productivity for parallel testing decreases
Solution Approach 1:
Multiple modules are combined on a single module plate that maintains the standard wafer diameter for compatibility with existing equipment. The plate includes multiple recesses positioned to accommodate different module sizes and configurations, allowing several modules to be tested simultaneously in parallel on one plate, thereby increasing productivity while maintaining ease of operation for individual module access.
Solution Approach 2:
The module plate is segmented into multiple recesses, each capable of holding a individual module. This segmentation allows modules to be tested individually or in various combinations, providing flexibility for both individual module testing and parallel testing of multiple modules simultaneously, thus improving productivity without sacrificing ease of operation.
3Reliability
If modules are tested using traditional socket methods, then testing can be performed, but thermal contact and support accuracy are insufficient
Solution Approach 1:
The module plate features locally optimized recesses with specific depth and dimensional characteristics tailored to different module types. Each recess is designed to provide proper support and thermal contact for the specific module it accommodates, ensuring that the module's bottom surface maintains accurate thermal and mechanical contact with the plate during testing, thereby improving both reliability and measurement precision.
Data Source
AI summary
A module plate is provided for use with a wafer handler and testing mechanism. The module plate has a diameter equivalent to an integrated circuit wafer and a height equivalent to or less than a height of a module lid associated with each module in a plurality of modules associated with the module plate. The module plate has a plurality of cutouts in the module plate that have a width equivalent to a width of the module lid and at least a length equivalent to a length of the module lid. The height of the module plate is such that, when a test head contacts a module base of each module in a plurality of modules, the module lid contacts a chuck on which the module plate resides during testing of the module thereby providing resistance in order to accurately test the module.