Wafer Sludge Suction Flow Design to Prevent Contamination

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Solution Overview

Problem

Conventional wafer processing apparatuses face issues with substrate contamination and flow line clogging due to residual foreign materials and chemical solutions.

Innovation Solution

A wafer processing apparatus equipped with a suction nozzle, a flow line, a suction tank, and an ejector that generates suction pressure to remove sludge and chemical solutions from the processing area, preventing contamination and clogging.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a spray nozzle sprays chemical solution onto the substrate during processing, then the substrate processing function is achieved, but sludge and residual chemical solution remain in the nozzle causing contamination and clogging

Engineering Contradiction:

Improvesubstrate processing reliabilityVSAvoidsubstrate contamination from residual sludge and chemical solution

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The suction nozzle performs preliminary suction action during the substrate processing to remove sludge and chemical solution in advance, preventing them from remaining in the spray nozzle and causing subsequent contamination

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The suction nozzle extracts and removes the harmful sludge and chemical solution from the spray nozzle during processing, separating the harmful substances from the processing system to prevent contamination

Inventive Principle:

Principle #2Taking out (Extraction)

2Productivity

If the spray nozzle continuously sprays chemical solution, then processing efficiency is maintained, but the flow line becomes clogged with accumulated sludge

Engineering Contradiction:

Improvesubstrate processing efficiencyVSAvoidflow line clogging from sludge accumulation

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The suction nozzle operates continuously during substrate processing to maintain continuous removal of sludge, ensuring the flow line remains clear throughout the processing operation without interruption

Inventive Principle:

Principle #20Continuity of useful action

Solution Approach 2:

The suction nozzle acts as an intermediary device between the spray nozzle and the flow line, intercepting and removing sludge before it can accumulate and clog the flow line

Inventive Principle:

Principle #24Intermediary (Mediator)

3Manufacturing precision

If foreign materials remain on the substrate surface after processing, then the substrate quality deteriorates, but additional cleaning steps increase processing time

Engineering Contradiction:

Improvesubstrate surface qualityVSAvoidadditional cleaning time required

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The suction nozzle performs preliminary cleaning action during the main processing step, removing foreign materials and sludge from the substrate surface before processing completes, eliminating the need for separate cleaning steps

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus effectively prevents substrate contamination and flow line clogging by ensuring complete removal of sludge and chemical solutions after processing, thereby maintaining the integrity of the substrate and the processing equipment.

Implementation Method 1

an ejector installed on a flow line to generate suction pressure in the suction nozzle and the flow line

Methodology Applied

Scientific EffectPressure difference: Pressure Gradient

Implementation Method 2

a filter unit disposed inside the suction tank body to filter the sludge discharged from the flow line

Methodology Applied

Scientific EffectFiltration: Filter (physical)

Data Source

PatentUS12322607B2Wafer processing apparatus and wafer processing method

Publication Date: 2025.06.03 ZEUS

AI summary

A wafer processing apparatus of the present invention includes a suction nozzle configured to suction sludge from a cup housing, a flow line connected to the suction nozzle such that the sludge and a chemical solution flow therein, a suction tank connected to the flow line such that the sludge and the chemical solution flow thereto, and an ejector installed on a flow line to generate suction pressure in the suction nozzle and the flow line.