Wafer Support with Sol-Gel Connecting Layer for Stress-Free Thinning
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Solution Overview
Problem
Conventional methods for thinning and processing wafers face challenges such as mechanical and thermal stresses, which hinder the production of very thin wafers due to inadequate support layers that do not adapt well to three-dimensionally structured surfaces, leading to damage and high production costs.
Innovation Solution
A wafer/support arrangement featuring a sol-gel connecting layer and an elastomer layer, where the sol-gel layer is produced from specific silicon-based monomers, allowing for a stress-free separation of the support system from the wafer, with the elastomer layer being compatible with silicon-based materials and providing a cost-effective, non-toxic solution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the wafer is thinned to reduce original thickness, then the electronic component size is reduced, but the mechanical strength decreases making the wafer prone to breaking
Solution Approach 1:
A connecting layer made of sol-gel material is introduced as an intermediary between the wafer and the support system. This layer provides mechanical coupling while allowing for stress absorption, enabling the wafer to be handled and processed at reduced thickness without excessive breaking risk.
Solution Approach 2:
The support system combines multiple materials with complementary properties: a rigid support structure for stability, an elastomer layer for mechanical cushioning and stress distribution, and a sol-gel connecting layer for controlled adhesion. This composite structure enables both thin wafer processing and adequate mechanical strength.
2Device complexity
If conventional support layers are used, then the structure is simple, but the support layer does not adapt well to three-dimensionally structured surfaces leading to damage
Solution Approach 1:
The elastomer layer acts as a flexible intermediate film that can conform to three-dimensionally structured wafer surfaces. This flexibility allows the support system to adapt to surface variations without creating stress concentrations that would lead to wafer damage.
Solution Approach 2:
The sol-gel connecting layer's properties can be tuned by adjusting the sol-gel process parameters (precursor composition, drying conditions, curing temperature) to optimize adhesion strength and flexibility, enabling adaptation to different wafer surface geometries and processing requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the mechanical cutting of processed wafers without damage, reducing production costs and stresses, and allows for the adaptation of the sol-gel layer to specific requirements, including temperature resistance up to 450°C, ensuring compatibility with typical wafer production processes.
Implementation Method 1
a connecting layer, wherein the connecting layer is a sol-gel layer which can be produced from the monomers (1) Si(OR1)4
Implementation Method 2
a support system, which comprises a support and an elastomer layer
Data Source
AI summary
A wafer/support arrangement, including a wafer, a support system, which includes a support and an elastomer layer, and a connecting layer, wherein the connecting layer is a sol-gel layer. The invention further relates to a coated wafer for a wafer/support arrangement according to the invention, wherein a sol-gel layer is used as a connecting layer for a corresponding wafer/support assembly, and to a method for processing the back side of a wafer.