Wafer Spin Chuck Fluid Blocking Unit for Particle Contamination

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Solution Overview

Problem

In semiconductor fabrication, high-speed spinning of wafers during etching processes leads to ejection and accumulation of etching chemicals between the spin body and stationary body of a spin chuck, causing particle contamination and potential corrosion, which increases error rates and decreases yield.

Innovation Solution

A wafer spin chuck device with a stationary body that includes a blocking unit to prevent particle contamination by blocking the space between the spin body and stationary body using a fluid or protrusion parts, preventing chemical penetration and corrosion by forming a fluid blocking layer or using rounded-edge protrusions to physically block particles.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the wafer spins at high speed during etching, then the etching process efficiency is improved, but etching chemicals are ejected and accumulate on the wafer and mechanical parts, causing particle contamination and corrosion

Engineering Contradiction:

Improveetching process efficiencyVSAvoidparticle contamination and chemical corrosion

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent extracts and removes the harmful etching chemicals from the spinning wafer surface by introducing a counter-flow of gas through the stationary body. This gas flow extracts the ejected chemicals before they can accumulate on the wafer or contaminate mechanical parts, thereby resolving the contradiction between high-speed etching efficiency and particle contamination prevention

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces an intermediary gas flow through the stationary body that acts as a mediator between the spinning wafer and the chamber wall. This intermediary flow captures and transports the ejected etching chemicals away from critical areas, preventing both particle contamination on the wafer and chemical corrosion of mechanical components while maintaining high etching efficiency

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of manufacture

If the space between spin body and stationary body is open, then the structure is simple and easy to manufacture, but chemicals penetrate the space and cause corrosion of mechanical parts

Engineering Contradiction:

Improvestructural simplicityVSAvoidresistance to chemical corrosion

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent applies pneumatic principles by using a gas flow through the stationary body to create a protective barrier in the space between the spin body and stationary body. This pneumatic shield prevents chemicals from penetrating and corroding mechanical parts while maintaining the simple open structure, thus resolving the contradiction between ease of manufacture and resistance to chemical corrosion

Inventive Principle:

Principle #29Pneumatics and hydraulics

Solution Approach 2:

The patent creates an inert gas environment in the space between the spin body and stationary body by introducing a flow of inert gas through the stationary body. This inert atmosphere prevents chemical corrosion of mechanical parts while maintaining structural simplicity, resolving the contradiction between ease of manufacture and reliability against chemical corrosion

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Prevents particle contamination on the wafer surface and corrosion of mechanical parts by blocking particles and chemicals from entering the space between the spin body and stationary body, enhancing semiconductor fabrication accuracy and yield.

Implementation Method 1

the stationary body includes a blocking unit which blocks the space with a fluid

Methodology Applied

Scientific EffectFluid blocking:

Implementation Method 2

preventing chemicals from penetrating the space between a spin body and a stationary body

Methodology Applied

Scientific EffectFluid barrier formation:

Data Source

PatentUS8211269B2Wafer spin chuck and an etcher using the same

Publication Date: 2012.07.03 SYSTEM ENGINEERING MEGA SOLUTION CO LTD

AI summary

A wafer spin chuck and an etcher using the same are provided. According to an aspect of the present invention, there is provide a wafer spin chuck device comprising: a spin body which spins a wafer; and a stationary body which holds the spin body and is under the spin body with a space between the spin body and the stationary body, wherein the stationary body includes a blocking unit which blocks the space with a fluid.