Wafer Transfer Spindle Assembly With Wave-Spring Clamping

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Solution Overview

Problem

Existing spindle assemblies in multi-station process modules for semiconductor wafer processing experience loosening of components due to high operating temperatures, leading to maintenance issues and reduced operational reliability.

Innovation Solution

A spindle assembly utilizing a barrel nut with a wave spring to decouple fastener torque from clamping force, providing increased compliance for thermal expansion and securing ceramic end effectors through interlocking geometry, thereby preventing loosening and extending maintenance intervals.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If fasteners alone are used to clamp end effectors, then the structure is simple, but the fasteners loosen due to high operating temperatures

Engineering Contradiction:

Improvefastening structureVSAvoidfastener clamping stability

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The fastening system is segmented into distinct functional components: the barrel nut provides structural attachment, while the wave spring provides independent compliance and clamping force. This segmentation allows each component to optimize its specific function without compromising the other.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The wave spring changes its physical parameters (compression, wave amplitude) in response to thermal expansion, maintaining optimal clamping force across temperature variations. The spring's elastic modulus and geometry are designed to compensate for thermal effects on the ceramic end effector.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If existing fastener designs are used, then maintenance intervals are short, but operational reliability is reduced due to loosening

Engineering Contradiction:

Improveoperational reliabilityVSAvoidmaintenance interval

Core Design Contradiction:

ReliabilityVSDuration of action of moving object

Solution Approach 1:

The wave spring is pre-compressed to provide continuous compensatory force that anticipates and counteracts thermal expansion effects before they cause loosening. This beforehand cushioning prevents the harmful effect of temperature-induced gap formation.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The thermal expansion, which would normally cause loosening, is converted into a beneficial compressive force on the wave spring. The heat-induced expansion pushes the ceramic end effector against the spring, maintaining clamping pressure rather than reducing it.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Device complexity

If fastener torque is directly coupled to clamping force, then the structure is simple, but there is insufficient compliance for thermal expansion

Engineering Contradiction:

Improvefastening mechanismVSAvoidcompliance for thermal expansion

Core Design Contradiction:

Device complexityVSAdaptability or versatility

Solution Approach 1:

The wave spring acts as an intermediary element between the barrel nut and the ceramic end effector. It mediates the force transmission, decoupling the rigid torque application from the compliant clamping action, allowing independent optimization of both functions.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The wave spring introduces dynamic compliance to the otherwise static fastening system. Its wave geometry allows it to dynamically adjust its stiffness and compression in response to thermal cycles, maintaining optimal contact pressure throughout operation.

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively prevents loosening of components at high temperatures, enhancing the operational reliability and reducing maintenance needs of the spindle assembly in semiconductor wafer processing systems.

Implementation Method 1

provide an order of magnitude more compliance for thermal expansion

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 2

a barrel nut with a wave spring to decouple fastener torque from clamping force

Methodology Applied

Scientific EffectElasticity: Elasticity

Implementation Method 3

The novel use of a wave spring and interlocking geometry to secure the ceramic end effector

Methodology Applied

Scientific EffectMechanical interlocking: Mechanical Fastener

Data Source

PatentUS12334375B2Spindle assembly for wafer transfer in a multi-station process module

Publication Date: 2025.06.17 LAM RES CORP

AI summary

A spindle assembly for transferring wafers in a multi-station process module is provided, including: a hub body, the hub body configured to be rotated about a center axis; a plurality of end effectors, each end effector having a first end configured for connection to the hub body and a second end configured to support a wafer; a plurality of covers; a plurality of fastener assemblies; wherein the first end of each end effector is clamped between a respective cover and a respective outer portion of the hub body by a respective fastener assembly, the respective fastener assembly including a wave spring that provides a consistent clamping force.