Wafer Splitting With Adhesive Film Swarf Removal
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Solution Overview
Problem
The existing wafer processing methods face challenges with dust scattering and residue adherence during the division of wafers into individual device chips, leading to reduced quality due to processing swarf on the chip surfaces.
Innovation Solution
A wafer processing method that involves forming division initiating points, disposing an elastic sheet, coating with adhesive liquid, splitting the wafer into device chips, forming a solidified film, and removing processing swarf by peeling off the solidified film.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If external force is applied to divide the wafer into individual device chips, then the wafer is successfully divided into device chips, but dust scatters and adheres to face sides of the device chips, reducing quality
Solution Approach 1:
A sheet with elasticity is introduced as an intermediary between the wafer and the external force application system. The sheet captures dust particles generated during wafer division and prevents them from adhering to the device chip surfaces, thereby resolving the contradiction between efficient wafer division and dust contamination prevention
2Productivity
If the wafer is divided into individual device chips, then device chips are produced, but residues of the broken modified layer adhere to side surfaces and face sides of the device chips, causing quality reduction
Solution Approach 1:
The elastic sheet acts as a mediator that captures residues of the broken modified layer during the wafer division process. By positioning the sheet to contact the side surfaces of device chips, it prevents residue adhesion and maintains manufacturing precision while enabling continuous device chip production
3Manufacturing precision
If grinding is performed on the reverse side of the wafer, then the wafer is finished to desired thickness, but grinding swarf intrudes into dividing grooves and adheres to side surfaces of device chips, reducing quality in subsequent steps
Solution Approach 1:
The elastic sheet is positioned to contact the side surfaces of device chips during grinding operations. It serves as an intermediary that captures grinding swarf particles, preventing them from intruding into dividing grooves and adhering to chip surfaces, thereby eliminating the harmful effect while maintaining precise wafer thickness control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively captures and removes processing swarf from the side and face surfaces of device chips, preventing scattering and adherence in subsequent bonding and lamination steps, thus enhancing the quality of device chips.
Implementation Method 1
the adhesive liquid that has coated the exposed surface of the wafer in the adhesive liquid coating step is caused to enter dividing grooves formed by the splitting-up of the wafer
Implementation Method 2
forming a solidified film by solidifying the adhesive liquid in a state in which the sheet is expanded, after the splitting-up step
Data Source
AI summary
A wafer processing method includes a division initiating point forming step of forming division initiating points in projected dicing lines, a sheet disposing step of disposing, on a wafer, a sheet having elasticity, before or after the division initiating point forming step, and a splitting-up step of splitting the wafer into individual device chips by expanding the sheet and applying external force to the wafer. The splitting-up step includes an adhesive liquid coating step of coating an exposed surface of the wafer with adhesive liquid having fluidity before or after the sheet is expanded and causing the adhesive liquid to enter dividing grooves formed by the splitting-up of the wafer.