Wafer Stack Electrical Connector With Flexible Circuit Boards
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Solution Overview
Problem
As electronic systems become denser, the number of cables increases, leading to weight and space issues, particularly in applications like military and aerospace where weight reduction and space savings are crucial.
Innovation Solution
The use of a connector system featuring a housing with a cavity containing a wafer stack of parallel electrical wafers, connected via flexible printed circuit boards (FPCBs) and a contact sub-assembly, which includes a rigid printed circuit board with wafer contacts and mating contacts, allowing for flexible and customizable electrical connections without the need for additional circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of cables is increased to meet higher system density requirements, then the electrical connection capability is improved, but the weight and space occupation increase
Solution Approach 1:
Multiple electrical wafers are combined into a single integrated wafer stack assembly that consolidates multiple cable connections into one unified component. This merging approach maintains high electrical connection capability while significantly reducing overall system weight compared to using separate cables for each connection.
Solution Approach 2:
The patent transitions from planar cable routing to a three-dimensional wafer stack architecture. By stacking multiple electrical wafers vertically within a compact housing, the system achieves high connection density in the vertical dimension while minimizing horizontal space occupation and reducing cable-related weight.
2Adaptability or versatility
If the number of cables is increased to provide more electrical connections, then the connectivity is improved, but the space occupied increases
Solution Approach 1:
Multiple electrical wafers are nested within a single housing cavity in a stacked configuration. This nesting approach allows multiple connection layers to occupy the same horizontal footprint, providing high connectivity while minimizing the overall volume required for the connector assembly.
Solution Approach 2:
The connector utilizes the vertical dimension by stacking electrical wafers one above another within the housing. This vertical arrangement enables multiple electrical connections to be achieved within a compact horizontal footprint, effectively increasing connectivity without proportionally increasing the occupied space.
3Reliability
If traditional cable connectors are used to establish communications, then the system is reliable, but the weight and space requirements increase
Solution Approach 1:
The patent replaces the traditional mechanical cable connector system with an integrated wafer stack architecture. This substitution eliminates the need for separate cable assemblies and their associated connectors, reducing weight while maintaining reliable electrical communication through the integrated wafer-to-wafer connections.
Solution Approach 2:
The connector integrates multiple functions that were previously performed by separate components: the housing contains the wafer stack, which provides both structural support and electrical connection functionality. This merging of functions reduces the overall weight of the connector assembly while maintaining communication reliability.
Data Source
AI summary
An electrical connector includes a housing having a cavity. A wafer stack is received in the cavity. The wafer stack includes a plurality of electrical wafers arranged parallel to each other within the cavity. Each wafer includes a first edge and a second edge. Each wafer includes at least one trace between the first and second edges. The electrical connector includes a flex harness including a plurality of flexible printed circuit boards (FPCBs). The FPCBs are electrically connected to corresponding wafers.