Semiconductor Wafer Stage Temperature Control for Fast Local Heat Response
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Solution Overview
Problem
Existing temperature control devices for semiconductor wafers face delays in responding to local heat inputs due to the use of a single temperature sensor per zone and reliance on cooling liquid circulation, which diminishes response speed.
Innovation Solution
A temperature control device with a placement surface partitioned into multiple regions, each equipped with independent temperature adjustment and detection parts, and a control system that monitors and responds to the largest temperature change per unit time to adjust temperatures quickly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If only one temperature sensor is provided in each zone of the stage, then the device complexity is reduced, but the response speed to local heat input diminishes when the sensor is disposed far away from the heat input position
Solution Approach 1:
The placement surface is divided into multiple regions, and multiple temperature detection parts are provided in at least one of these regions. This segmentation allows the system to monitor temperature at multiple locations simultaneously, ensuring that at least one sensor is close to any local heat input position, thereby improving response speed without requiring sensors in every possible location.
Solution Approach 2:
The patent transitions from a single temperature sensor per zone to multiple temperature sensors distributed across partitioned regions. This dimensional change in sensor distribution allows comprehensive temperature monitoring across the placement surface, enabling rapid detection of local heat inputs regardless of their specific position.
2Device complexity
If temperature is controlled by circulation of cooling liquid, then the device structure is simplified, but the response speed to change in setting temperature diminishes
Solution Approach 1:
The patent replaces the mechanical cooling liquid circulation system with thermoelectric elements (Peltier elements) that directly convert electrical energy to thermal effects. This substitution eliminates the need for liquid circulation pumps, pipes, and flow control mechanisms, while providing much faster response to temperature changes through direct electrical control of heating and cooling.
Solution Approach 2:
The patent changes the fundamental parameter of temperature control from fluid-based heat transfer to solid-state thermoelectric conversion. By using thermoelectric elements that can rapidly change their thermal output in response to electrical input, the system achieves fast response speeds while maintaining relatively simple device structure.
3Speed
If multiple temperature detection parts are provided in each region, then the response speed to local heat input is improved, but the device complexity increases
Solution Approach 1:
The placement surface is segmented into multiple regions, with multiple temperature detection parts provided in at least one region. This segmentation strategy allows the system to achieve fast response to local heat inputs by having multiple sensors, while avoiding the need to place sensors in every single location, thus controlling overall device complexity.
Solution Approach 2:
The patent applies local quality by concentrating multiple temperature detection parts in specific regions where they are most needed for detecting local heat inputs. This selective distribution optimizes response speed in critical areas while minimizing the total number of sensors required, balancing performance with device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device enables rapid response to local heat inputs on semiconductor wafers by accurately detecting and adjusting temperatures using multiple sensors and thermoelectric elements, reducing response time and energy consumption.
Implementation Method 1
a temperature adjustment part configured to independently adjust a temperature of the placement part for each of the plurality of regions
Implementation Method 2
a plurality of temperature detection parts provided in at least one of the plurality of regions and configured to detect a temperature of the region
Data Source
AI summary
A temperature control device for a semiconductor wafer includes a placement part having a placement surface on which a semiconductor wafer is placed and having a plurality of regions in which the placement surface is partitioned in a plan view, a temperature adjustment part configured to independently adjust a temperature of the placement part for each of the plurality of regions, a plurality of temperature detection parts provided in at least one of the plurality of regions and configured to detect a temperature of the region of which the temperature has been adjusted by the temperature adjustment part, and a control part configured to monitor detection temperatures of the plurality of temperature detection parts, to select one having a large temperature change per unit time among a plurality of monitored detection temperatures, and to control the temperature adjustment part based on the selected detection temperature.