Wafer Storage Container Branch Passage Purge Gas Injection
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Solution Overview
Problem
Existing wafer storage containers face challenges in uniformly injecting purge gas to remove fumes and prevent oxidation, leading to non-uniform purging and the formation of dead regions due to differences in gas injection force and turbulence.
Innovation Solution
A wafer storage container design featuring an injection member with a branch passage structure on its circumferential surface, allowing purge gas to flow uniformly across the storage chamber, minimizing dead regions and turbulence, and enabling efficient purging through optimized injection hole placement and flow control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If gas is introduced into simple chamber-shaped gas injection chambers, then the structure is simple, but the gas injection force becomes non-uniform due to differences between upper and lower regions
Solution Approach 1:
The gas injection chamber is divided into multiple independent injection holes distributed across different regions (upper, lower, front, rear). Each injection hole operates independently to deliver gas uniformly across the storage chamber, eliminating the non-uniformity inherent in simple chamber structures.
Solution Approach 2:
Different regions of the gas injection chamber are equipped with injection holes positioned to address local purging needs. The injection holes are strategically placed to ensure that gas is delivered uniformly to all areas of the storage chamber, with each location receiving appropriate gas flow for effective fume removal.
2Area of stationary object
If gas is injected from regions far from gas inlet holes, then the injection force becomes non-uniform, but this allows broader coverage of the storage chamber
Solution Approach 1:
The gas injection system uses multiple segmented injection holes positioned at various distances from the gas inlet. This segmentation allows gas to be delivered to both near and far regions of the storage chamber with controlled flow characteristics, ensuring uniform injection force across the entire coverage area.
Solution Approach 2:
The injection holes are arranged in a multi-dimensional pattern across the gas injection chamber, not just in a single plane or direction. This spatial distribution ensures that gas reaches all regions of the storage chamber uniformly, including areas far from the inlet, by utilizing three-dimensional space for optimal gas flow distribution.
3Productivity
If multiple gas injection chambers are used to improve purging coverage, then the purging effectiveness increases, but the device complexity and size increase
Solution Approach 1:
Multiple gas injection functions are merged into a single integrated gas injection chamber. The chamber contains multiple injection holes that collectively provide comprehensive purging coverage, eliminating the need for separate gas injection chambers while maintaining high purging efficiency.
Solution Approach 2:
The gas injection chamber serves multiple functions simultaneously: it provides gas injection to upper and lower regions, front and rear areas, and ensures uniform distribution across the entire storage chamber. This multi-functionality achieves comprehensive purging coverage without increasing the number of separate chambers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design ensures uniform purging across the wafer storage chamber, reducing dead regions and maintaining high flow velocity of purge gas, thereby enhancing wafer purging efficiency and allowing for size reduction of the storage container.
Implementation Method 1
an injection member disposed on at least a portion of a circumferential surface of the storage chamber and injecting purge gas into the storage chamber
Data Source
AI summary
The present invention relates to a wafer storage container capable of removing fumes on a wafer or removing moisture therefrom by supplying purge gas to the wafer stored in a storage chamber. More particularly, the present invention relates to a wafer storage container, in which uniform purge gas injection is achieved and thus formation of dead regions is minimized, formation of turbulence in a storage chamber is prevented and thus wafer purging efficiency is improved, and a size reduction of an injection member injecting purge gas into the storage chamber is achieved and thus a size reduction of the entire wafer storage container is achieved.