Wafer Storage Container With Segmented Gas Flow Zones
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Solution Overview
Problem
Existing wafer storage containers lack independent spaces for gas injection and exhaustion, leading to non-uniform gas flow and potential dead zones where purge gas does not reach the wafers, resulting in incomplete removal of residual fumes and contamination of semiconductor equipment.
Innovation Solution
The wafer storage container is designed with separate storage, gas injection, and gas exhaustion rooms, featuring gas inlet and outlet holes in the bottom and side surfaces, respectively, and pipes and plates that facilitate uniform gas distribution and flow, ensuring that purge gas reaches all areas of the wafer surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a tube type element is used to inject purge gas vertically, then the structure is simple, but dead zones occur where purge gas does not reach and gas flow is non-uniform
Solution Approach 1:
The container is divided into three independent spaces (wafer storage space, gas injection space, gas exhaustion space) separated by partition walls. This segmentation allows gas to be injected uniformly from multiple directions (front, rear, left, right) rather than from a single vertical source, eliminating dead zones and ensuring uniform gas flow across all wafer surfaces.
2Device complexity
If gas injection and exhaustion areas are integrated without separation, then the device complexity is reduced, but the gas flow becomes non-uniform and dead zones are created
Solution Approach 1:
The container interior is segmented into distinct functional zones: wafer storage space for holding wafers, gas injection space for introducing purge gas through inlet holes in partition walls, and gas exhaustion space for removing contaminated gas through outlet holes. This spatial segmentation ensures systematic gas flow patterns that efficiently remove fumes without creating dead zones.
Solution Approach 2:
Partition walls serve as intermediary structures between the gas injection space and wafer storage space. These walls contain inlet holes that control gas flow direction and distribution, acting as mediators to achieve uniform gas distribution across the wafer surfaces while maintaining independent control of injection and exhaustion functions.
3Productivity
If purge gas is injected intensively on a specific area, then the injection efficiency is high, but dead zones occur where gas is not injected
Solution Approach 1:
Different regions of the container are assigned different functions: the front and rear partition walls have inlet holes for gas injection, while the left and right partition walls have outlet holes for gas exhaustion. This local differentiation of qualities ensures that gas is injected uniformly from multiple locations rather than concentrated in one area, eliminating dead zones while maintaining efficient gas flow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for efficient removal of residual fumes from wafer surfaces without dead zones, enhancing the reliability of semiconductor manufacturing by ensuring uniform gas flow and preventing contamination.
Implementation Method 1
a gas injection room (120, 130) which is located along one surface of the storage room (110) and communicates with the storage room (110) through the side surface of the storage room (110)
Data Source
AI summary
The present invention relates to a wafer storage container, more particularly, relates to a wafer storage container wherein the space of the wafer storage container is divided into the spaces, namely a storage room, a gas injection room, and a gas exhausting room, which are independent and separate from each other, so when the wafer storage container is transported to the load port and being coupled therewith, the purge gas is injected/exhausted through the separating walls inside the storage room, thereby efficiently removing the remaining fumes on the surface of the wafer.