450 mm Wafer Storage Using Vertical Elevating Mechanism
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Solution Overview
Problem
The challenge is to maintain the same throughput and footprint as conventional substrate heat treatment apparatuses designed for 300 mm wafers while accommodating larger 450 mm wafers, which require more space and taller conveyance containers, making it difficult to store a sufficient number of conveyance containers within the same footprint.
Innovation Solution
The substrate heat treatment apparatus incorporates a conveyance storage unit with a first and second storage section, an elevating mechanism to adjust the vertical position of conveyance containers, and a conveyance mechanism to efficiently transfer and store multiple wafers, allowing for the accommodation of 450 mm wafers without increasing the footprint by utilizing an elevating mechanism that supports a load of 50 kg or more and includes a ball screw position displacement member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the wafer diameter is increased from 300 mm to 450 mm, then the wafer capacity and processing capability are improved, but the conveyance container size and height increase, making it difficult to store sufficient containers within the same footprint
Solution Approach 1:
The patent introduces a second storage section disposed below the conveyance mechanism, utilizing the vertical dimension (downward direction) to expand storage capacity. This allows the apparatus to store conveyance containers for 450 mm wafers without increasing the horizontal footprint, effectively transitioning from two-dimensional to three-dimensional space utilization.
2Volume of moving object
If the conveyance container height is increased to accommodate 450 mm wafers, then the wafer accommodation capability is improved, but the storage density and number of storable containers are reduced
Solution Approach 1:
By disposing the second storage section below the conveyance mechanism in the vertical direction, the patent enables storage of multiple high-volume conveyance containers within the same footprint. The elevating mechanism further optimizes vertical space utilization by adjusting container positions.
Solution Approach 2:
The second storage section is nested within the overall apparatus structure below the conveyance mechanism, allowing efficient use of internal volume. This nested configuration enables storage of additional containers without increasing the external dimensions of the apparatus.
3Area of stationary object
If the same footprint is maintained as conventional apparatuses, then the installation space requirement is reduced, but the ability to store sufficient conveyance containers for 450 mm wafers is compromised
Solution Approach 1:
The patent resolves this contradiction by utilizing the vertical dimension through the second storage section disposed below the conveyance mechanism. This enables the apparatus to maintain a compact footprint while storing sufficient conveyance containers for 450 mm wafers by expanding into the third dimension.
4Volume of stationary object
If the elevating mechanism is added to adjust vertical position of conveyance containers, then the space utilization and storage capacity are improved, but the device complexity and manufacturing cost increase
Solution Approach 1:
The elevating mechanism uses a ball screw mechanism to convert rotational motion into linear vertical displacement, providing precise and controlled position adjustment. This mechanical substitution enables efficient space utilization while maintaining manageable system complexity through well-established mechanical principles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the storage of a sufficient number of conveyance containers with the same footprint as conventional apparatuses handling 300 mm wafers, improving throughput by efficiently managing the increased size of 450 mm wafers and their containers within the existing space.
Implementation Method 1
includes a ball screw position displacement member
Data Source
AI summary
Disclosed is a substrate heat treatment apparatus. The apparatus includes: a conveyance storage unit which includes a first storage section and a second storage section each of which stores a plurality of conveyance containers, and a conveyance mechanism configured to convey the conveyance containers, each of the conveyance containers accommodating a plurality of wafers; and a heat treatment unit including a heat treatment furnace which accommodates a holder configured to hold the plurality of wafers in multiple stages, and performs the heat treatment on the wafers. A mounting stage of a transfer section is provided below the first storage section in the conveyance storage unit. On the mounting stage, the conveyance containers are mounted so that the wafers within the conveyance containers are transferred to the holder in the heat treatment unit.