Wafer Storage Fins With Vacuum Binding for Clean Transport
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Solution Overview
Problem
Semiconductor wafer storage devices face challenges in maintaining humidity and contamination control, leading to defects and reduced production yield due to moisture and particle contamination during transport and storage.
Innovation Solution
The storage device incorporates fin structures with protrusions and binding devices, such as padding layers with vacuum suction or clips, to securely hold wafers in place, preventing displacement and contamination during transport.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If wafers are stored in open or loosely secured configurations, then ease of operation and accessibility are improved, but wafer stability and contamination control deteriorate
Solution Approach 1:
The storage device employs movable fin structures that can transition between extended and retracted positions. During transport, fins extend to secure wafers firmly in place. During loading/unloading operations, fins retract to allow easy wafer access. This dynamic adjustment resolves the contradiction between stability during transport and ease of operation during maintenance.
Solution Approach 2:
The invention adds a spatial dimension to wafer securing by using protruding fin structures that extend into the wafer storage space. These fins create physical barriers and contact points that stabilize wafers without requiring complex mechanical clamps or locks, thus maintaining ease of operation while improving stability.
2Reliability
If wafers are securely bound to prevent displacement, then wafer stability is improved, but device complexity increases due to additional binding mechanisms
Solution Approach 1:
The storage device is divided into multiple independent fin structures distributed throughout the wafer storage space. Each fin acts as an independent securing element that can be简单地 engaged or disengaged. This segmentation allows stable wafer binding without requiring a single complex binding mechanism, thus improving reliability while minimizing device complexity.
Solution Approach 2:
The fin structures serve as intermediary elements between the wafer and the storage device walls. Rather than directly clamping wafers with complex mechanisms, the fins act as simple protruding intermediaries that provide mechanical support and prevent displacement through their geometric configuration alone.
3Productivity
If transport duration is extended, then productivity is improved by allowing longer processing intervals, but contamination risk increases due to prolonged exposure
Solution Approach 1:
The fin structures are positioned and configured in advance to provide continuous wafer support and protection during the entire transport duration. By establishing this protective configuration before transport begins, the system prevents contamination exposure throughout the extended processing interval, thus enabling longer productivity cycles without increasing contamination risk.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances wafer stability and reduces particle contamination, thereby improving production yield by minimizing defects caused by moisture and particle exposure.
Implementation Method 1
a top surface of the padding layer can have at least one opening configured to provide a vacuum to bind the wafer over the protrusion
Data Source
AI summary
The present disclosure describes a method for substrate storage. The method can include respectively placing a plurality of substrates into a plurality of slots formed by a plurality of fin structures on a panel of a storage device. The method can further include binding each of the plurality of substrates to an corresponding one of the plurality of fin structures. The method can further include moving the storage device from a first location to a second location. The method can further include un-binding the plurality of substrates from the plurality of fin structures.