Wafer-Suction Chuck Cleaning Device with Automated Frame Scraper
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Solution Overview
Problem
The existing cleaning devices for wafer-suction chuck mechanisms require manual operation for cleaning the frame suction-holding section, which results in poor workability and inefficiency.
Innovation Solution
A cleaning device equipped with frame suction-holding section cleaning means, including a scraper, brush, and water nozzle, that can be moved onto the frame suction-holding section to automatically remove sludge, interlocked with the suction chuck cleaning grinding stone section for simultaneous cleaning of both sections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If manual cleaning is performed on the frame suction-holding section using a water gun and BEMCOT, then cleaning can be achieved, but workability is poor and the process is inefficient
Solution Approach 1:
The cleaning device enables the frame suction-holding section to clean itself automatically through integrated cleaning mechanisms. The rotating brush and scraper components are driven by the chuck table's rotation, eliminating the need for manual operator intervention with water guns and cleaning materials, thereby improving both ease of operation and cleaning efficiency
Solution Approach 2:
The cleaning function is merged with the existing chuck table structure. The cleaning mechanisms (brush, scraper, water nozzle) are integrated into the chuck table assembly, allowing simultaneous cleaning of both the wafer suction-holding section and frame suction-holding section during normal operation, thereby improving productivity without adding separate manual cleaning processes
2Reliability
If a dress grinding stone is used to clean the chuck surface, then cleaning is effective, but the frame suction-holding section requires separate manual cleaning
Solution Approach 1:
Multiple cleaning functions are merged into a single integrated system. The dress grinding stone for cleaning the chuck surface and the new cleaning mechanisms (brush, scraper, water nozzle) for the frame suction-holding section are combined into one automated cleaning process that operates simultaneously, reducing device complexity by eliminating separate manual cleaning steps
Solution Approach 2:
The cleaning device is designed with multi-functionality to handle both the wafer suction-holding section and frame suction-holding section. The rotating brush and scraper can clean both surfaces, and the water nozzle system provides rinsing for both areas, thereby improving reliability while maintaining manageable device complexity through universal cleaning components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device enables automatic and efficient cleaning of both the wafer-suction chuck section and the frame suction-holding section, improving workability and reducing manual intervention.
Implementation Method 1
either one of a brush and a scraper is brought into contact with the frame suction-holding section while discharging water thereonto from the water nozzle, the sludge floats with the water
Implementation Method 2
the sludge is scraped by either one of the brush and the scraper
Data Source
AI summary
A cleaning device for a wafer-suction chuck mechanism capable of automatically and simply performing cleaning treatment on a chuck surface that suction-holds a wafer and cleaning treatment on a frame suction-holding section. The cleaning device is configured to include a scraper 17 and a brush 18 that press frame suction-holding section cleaning means 10B for removing a sludge on a frame suction-holding section 11B onto the frame suction-holding section 11B, and a water nozzle 19 that discharges and supplies water onto the frame suction-holding section 11B.