Wafer Adjustment Chamber with Suction Stress Balancing
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Solution Overview
Problem
Current wafer adjustment processes are lengthy, leading to increased production time and reduced output of semiconductor structures due to the need for extensive intermediate adjustments in position, temperature, and stress, which are process and chamber-specific.
Innovation Solution
A device comprising a lifting module, a carrier module, and a suction module that adjusts the wafer's position and stress by ascending and descending to precise positions and applying controlled suction forces through multiple discrete suction openings to balance stress and temperature, allowing for simultaneous vertical adjustment and stress relief.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If intermediate adjustment is performed to ensure wafer state meets process requirements, then manufacturing precision is improved, but loss of time increases
Solution Approach 1:
The patent combines multiple adjustment functions (positioning, temperature control, stress relief) into a single integrated wafer adjustment device. The positioning module, temperature module, and suction module work simultaneously to adjust the wafer's position, temperature, and stress state in one coordinated operation, thereby reducing the total adjustment time while maintaining precision requirements.
Solution Approach 2:
The device performs preliminary temperature adjustment and stress relief before the wafer enters the reaction chamber. By pre-adjusting the wafer state in advance using the temperature module and suction module, the system reduces the adjustment time needed during the production process, as the wafer is already prepared for the next process step.
2Manufacturing precision
If multiple separate adjustment operations are performed for position, temperature, and stress, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The patent integrates the positioning module, temperature module, and suction module into a single unified device structure. These modules share common components such as the wafer carrier, control system, and housing, allowing multiple adjustment functions to be performed simultaneously without requiring separate devices for each function, thus reducing overall system complexity.
Solution Approach 2:
The wafer adjustment device is designed as a multi-functional unit where a single device performs positioning, temperature control, and stress relief functions. The positioning module handles vertical and horizontal positioning, the temperature module controls thermal state, and the suction module manages stress, all within one integrated system that can adapt to different adjustment requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution shortens the wafer adjustment time, improves stress balance, and enhances production capacity by integrating temperature and stress adjustment into a single process, preventing the double helix phenomenon and reducing the risk of wafer damage.
Implementation Method 1
a suction module, the suction module comprising a first suction opening facing the wafer and surrounded by the second carrier surface, and the suction module being configured to adsorb the wafer through the first suction opening
Data Source
AI summary
Embodiments of the present disclosure provide a device for adjusting a wafer, a reaction chamber, and a method for adjusting a wafer. The device for adjusting a wafer includes: a lifting module, the lifting module including a first carrier surface configured to carry a wafer, and the first carrier surface ascending to a preset highest position or descending to a preset lowest position relative to a reference surface; a carrier module, the carrier module including a second carrier surface, a position of the second carrier surface being higher than the preset lowest position and being lower than the preset highest position, and the second carrier surface being configured to receive and carry the wafer carried on the first carrier surface; and a suction module, the suction module including a first suction opening facing the wafer and surrounded by the second carrier surface.