Wafer Supply Apparatus Push-Up Section for High-Speed Peeling
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Solution Overview
Problem
Conventional component mounting systems are slow and lack accuracy in peeling components from adhesive sheets due to continuous load measurement and cam-driven push-up mechanisms.
Innovation Solution
A wafer supply apparatus with a push-up section and dual lifting and lowering devices that allow for high-speed and accurate component peeling, featuring a load measuring section and control system to maintain a predetermined push-up load, ensuring precise and efficient component removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a cam-driven push-up mechanism with continuous load measurement is used, then the push-up load can be controlled, but the component peeling speed becomes slow
Solution Approach 1:
The lifting and lowering device is divided into two independent sections: a first section responsible for high-speed positioning and a second section responsible for precise load-controlled peeling. This segmentation allows each section to optimize for its specific function, resolving the contradiction between speed and precision in the original cam-driven single-section system.
Solution Approach 2:
The system dynamically switches between two operational modes: high-speed positioning mode using the first lifting section, and precise peeling mode using the second lifting section with load feedback. This dynamic operation allows the system to achieve both high speed and high precision control at different stages of the peeling process.
2Device complexity
If a cam mechanism is used to lift the push-up pin, then the mechanism is simple, but the peeling accuracy is insufficient
Solution Approach 1:
The lifting mechanism is segmented into two independent lifting and lowering devices, each with specific functions. The first device handles coarse positioning with simple mechanics, while the second device provides fine control with load feedback for high precision peeling, maintaining simplicity where possible while adding complexity only where necessary for accuracy.
Solution Approach 2:
The second lifting and lowering device incorporates load feedback control to precisely regulate the push-up load during peeling. This feedback mechanism ensures accurate peeling by continuously monitoring and adjusting the applied force, compensating for the limitations of simple mechanical cam-driven systems.
3Area of stationary object
If the push-up pin is lifted by rotating the cam, then the structure is compact, but the peeling speed is reduced due to continuous measurement
Solution Approach 1:
The system separates the positioning function (handled quickly by the first lifting device) from the peeling function (handled with load control by the second lifting device). This allows the majority of the motion to be completed at high speed, with load measurement and control applied only during the final peeling stage, thereby maintaining compactness while improving overall speed.
Solution Approach 2:
The system employs periodic action by applying load measurement and control only during the specific peeling phase rather than continuously during the entire lifting process. This reduces the time spent on measurement and control operations, thereby increasing peeling speed while maintaining system compactness.
Data Source
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AI summary
A wafer supply apparatus is provided with a die peeling device which, when a component mounting apparatus picks up die D from a die sheet to which wafer W is adhered, causes the lower face of the die sheet to be pushed up by push-up pin 71, separating die D to be picked up from the die sheet. The die peeling device is configured to include push-up pin 71, first lifting and lowering device 61 for lifting and lowering first Z-axis slider 63, and second lifting and lowering device 65, which is lifted and lowered together with first Z-axis slider 63, and lifts and lowers push-up pin 71 relative to first Z-axis slider 63.