Wafer Support Structure With Adjustable Leveling and Locking
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Solution Overview
Problem
Existing wafer support structures in semiconductor processing are difficult to adjust and level, leading to issues such as slips and breaks during wafer transfer, which affect process yield.
Innovation Solution
A wafer support structure with a lifting component, supporting component, compressing component, and adjusting component, allowing for fine adjustments of levelness and centerline angle through an adjustment mechanism involving nested expansion sleeves and threaded connection rods, enabling precise leveling and locking of the supporting component.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the wafer support structure uses a fixed rigid design, then the structure is simple and easy to manufacture, but it cannot be adjusted for levelness causing slips or breaks during wafer transfer
Solution Approach 1:
The wafer support structure is divided into multiple adjustable components including the cross beam with adjustment mechanisms, the lifting shaft, and the bracket. Each component can be independently adjusted to achieve proper levelness and alignment, transforming a single rigid structure into modular adjustable segments that can be precisely positioned.
Solution Approach 2:
The structure transitions from a fixed rigid design to a dynamically adjustable one. The cross beam includes adjustment mechanisms that allow real-time modification of the bracket's position and angle during installation and maintenance, enabling the structure to adapt to different operational requirements and achieve optimal levelness.
2Ease of operation
If the wafer support structure is difficult to adjust, then the manufacturing cost is lower, but the assembly and maintenance time increases
Solution Approach 1:
The adjustment mechanisms are pre-configured into the cross beam structure during manufacturing, with adjustment holes and positioning features already in place. This preliminary preparation allows for quick field adjustments without requiring complex tools or procedures, significantly reducing assembly and maintenance time while maintaining ease of operation.
3Manufacturing precision
If the supporting component is not properly leveled, then the device is simpler, but slips or breaks occur during wafer transfer affecting process yield
Solution Approach 1:
The adjustment capabilities are concentrated at specific critical locations where levelness and alignment are most needed, such as the cross beam and bracket connection points. Rather than making the entire structure complex, localized adjustment mechanisms are implemented only where precision is required, achieving high manufacturing precision without excessive overall complexity.
Data Source
Figure 1A
Figure 1B~2A
Figure 2B~2C
AI summary
The present disclosure provides a semiconductor process device and a wafer support structure. The wafer support structure includes: a lifting component, a supporting component, a compressing component, and an adjusting component. The lifting component includes a lifting shaft. A mounting section is provided on the top surface of the lifting shaft. A first end of the supporting component is sleeved in a mounting hole of the mounting section. An inner peripheral wall of the mounting hole and an outer peripheral wall of the mounting section are separated by an adjustment space. The compressing component is sleeved on an outer periphery of the mounting section and located in the adjustment space. The adjusting component is connected with the support component. A portion of the adjusting component is located in the adjustment space and squeezes the compressing component to deform to lock the mounting section and the supporting component. The adjusting component is configured to adjust a degree of compression of the compressing component at different positions in a circumferential direction of the mounting hole to adjust levelness and/or a centerline angle of the supporting component. The present disclosure can quickly perform levelness adjustment of the supporting component, thereby reducing cost of assembly and maintenance.