Wafer Support Member Vacuum Tightness via Buried Conductive Layer
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Solution Overview
Problem
Existing wafer support members in semiconductor processing systems face challenges with complex manufacturing processes, vacuum tightness issues, and unreliable electrical connections due to complicated structures and thermal expansion differences, leading to potential cracks and broken vacuum tightness.
Innovation Solution
A simplified wafer support member design featuring a plate-shaped ceramic body with a penetrating via hole, a conductive layer on the mount surface, a buried conductive layer, and a conducting terminal that connects to the buried layer without crossing with pipes, ensuring reliable electrical connections and maintaining vacuum tightness through the elimination of unnecessary brazing and voids.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a complicated connecting structure body with multiple via holes and conductive layers is used to connect electrodes, then electrical connection is achieved, but the structure becomes complex and manufacturing process becomes complicated
Solution Approach 1:
The connecting structure is divided into distinct functional layers: a first connecting structure on the front surface and a second connecting structure on the rear surface of the substrate. This segmentation allows each layer to be optimized independently and simplifies the overall manufacturing process by enabling separate formation of each connecting layer.
Solution Approach 2:
The invention extracts and eliminates unnecessary intermediate conductive layers and complex via hole arrangements from the conventional structure. By directly connecting electrodes through simplified via holes that extend through the substrate, the patent removes redundant components while maintaining electrical connection functionality.
2Adaptability or versatility
If wiring and pipe cross each other in the wafer support member, then electrical connection and gas supply are both achieved, but vacuum tightness is broken due to void formation
Solution Approach 1:
The patent resolves the spatial conflict between wiring and pipe by transitioning to a different dimensional arrangement. The wiring is embedded within the substrate plane while the pipe is positioned on the surface, utilizing the third dimension (depth/height) to separate their paths. This eliminates the need for crossing and prevents void formation that would compromise vacuum tightness.
Solution Approach 2:
The substrate acts as an intermediary layer that separates and routes the wiring and pipe along different paths. The wiring is embedded in the substrate while the pipe is positioned on its surface, allowing both functions to coexist without direct interaction that would create vacuum-tightness issues.
3Reliability
If brazing is used to connect wiring to conductive layers, then electrical connection is achieved, but thermal expansion differences cause distortion and cracks after repeated heating and cooling
Solution Approach 1:
The invention completely eliminates the brazing process and associated brazing materials from the connection method. Instead of using thermal brazing that causes distortion and cracks, the patent employs mechanical embedding of wiring in conductive grooves and direct contact through vias, removing the source of thermal expansion-related failures.
Solution Approach 2:
The patent replaces the thermal-based brazing process with a mechanical connection system. Wiring is mechanically embedded in conductive grooves and connected through mechanical vias, eliminating the need for high-temperature brazing that causes thermal distortion and subsequent cracking during thermal cycling.
4Reliability
If multiple via holes and conductive layers are arranged to connect electrodes, then electrical connection is achieved, but the manufacturing process becomes complicated
Solution Approach 1:
The manufacturing process is segmented into distinct, simplified steps: forming via holes through the substrate, embedding wiring in front-surface grooves, and establishing rear-surface connections. This segmentation allows each step to be performed independently with standard manufacturing techniques, reducing overall process complexity.
Solution Approach 2:
The invention inverts the conventional approach by forming connections from both the front and rear surfaces simultaneously rather than building up multiple intermediate layers from one surface. This bidirectional connection strategy simplifies the manufacturing sequence and reduces the number of processing steps required.
Data Source
AI summary
A simple and practical wafer support member which holds vacuum tight comprises a plate-shaped ceramic body having one main surface of a mount surface on which a wafer is mounted and a penetrating via hole from one main surface to the other main surface, a conductive layer provided on the mount surface, a connection conductive layer provided on an inner surface of the via hole so as to be connected to the conductive layer, a buried conductive layer which is buried in the plate-shaped ceramic body so as to be connected to the connection conductive layer, and a conducting terminal having one end and the other end and arranged apart from the via hole Of the plate-shaped ceramic body so that it is connected to the buried conductive layer in the vicinity of its one end and the other end protrudes from the other main surface of the ceramic body.