Semiconductor Wafer Support Gas Passage With Replaceable Insulating Sleeve
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Solution Overview
Problem
In semiconductor manufacturing apparatuses, when a gas common passage cannot be provided inside the ceramic plate, it is often placed inside the metal base plate, leading to the risk of electric discharge in the gas outlet passages due to the metal base plate's conductivity, and the insulating pipes embedded in the base plate become difficult to replace.
Innovation Solution
A semiconductor manufacturing apparatus design featuring a ceramic plate with a gas common passage inside the conductive base plate, where the number of gas inlet passages is less than the gas outlet passages, and an insulating sleeve is used in a base plate through-hole to prevent electric discharge, allowing for easy maintenance by replacing the insulating sleeve when it deteriorates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the gas common passage is provided inside the base plate, then the gas distribution function is achieved, but electric discharge occurs in the gas outlet passage due to metal conductivity
Solution Approach 1:
An insulating pipe is introduced as an intermediary component to replace the metal base plate in the gas outlet passage region. This insulating pipe serves as a mediator that allows gas flow while preventing electric discharge, thus resolving the contradiction between achieving gas distribution function and preventing electric discharge in the metal base plate.
Solution Approach 2:
The base plate structure is modified with local quality changes: an insulating pipe is specifically positioned in the gas outlet passage region where electric discharge risk exists, while the rest of the metal base plate maintains its structural and thermal functions. This localized insulation approach prevents electric discharge without compromising overall gas distribution capability.
2Reliability
If the insulating pipe is embedded in the base plate, then electric discharge is prevented, but the insulating pipe cannot be accessed for replacement
Solution Approach 1:
The gas outlet passage system is segmented into removable components: the insulating pipe is designed as a separate, detachable component from the base plate. This segmentation allows the insulating pipe to be independently accessed and replaced without removing or damaging the base plate, thus maintaining electric discharge prevention while enabling easy maintenance.
Solution Approach 2:
The insulating pipe is designed with dynamic accessibility - it can be in a fixed state during operation to prevent electric discharge, but can be easily removed and replaced when maintenance is needed. This dynamic design resolves the contradiction between providing stable electric discharge prevention during operation and enabling easy replacement during maintenance.
3Productivity
If multiple gas inlet passages are provided, then gas supply capability is improved, but the number of external connection pipes increases
Solution Approach 1:
Multiple gas inlet passages are merged and integrated within a single external connection pipe structure. This merging approach allows multiple gas supply channels to be accessed through one external connection point, thereby improving gas supply capability while avoiding the increase in external connection pipe complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents electric discharges in the gas outlet passages and facilitates easy maintenance by allowing for the replacement of the insulating sleeve, reducing the complexity of replacing multiple components.
Implementation Method 1
an insulating sleeve is disposed in a base plate through-hole which penetrates the base plate in up-down direction. The insulating sleeve has a first communication hole that constitutes part of the gas common passage, and a second communication hole that is provided to reach an upper surface of the insulating sleeve from the first communication hole, and constitutes part of the gas outlet passages. Thus, an electric discharge can be prevented from occurring in the gas outlet passages.
Data Source
AI summary
A member for semiconductor manufacturing apparatus includes: a ceramic plate having a wafer placement surface; a conductive base plate; a gas common passage provided inside the base plate; gas outlet passages provided to reach the wafer placement surface from the gas common passage; at least one gas inlet passage provided to communicate with the gas common passage from a lower surface of the base plate; and an insulating sleeve disposed in a base plate through-hole. The insulating sleeve has a first communication hole that constitutes part of the gas common passage, and a second communication hole that is provided to reach an upper surface of the insulating sleeve from the first communication hole, and constitute part of the gas outlet passages.