Wafer Support Insulating Heat-Conducting Unit for Stable AC Bias
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Solution Overview
Problem
During thin-film deposition processes, alternating-current (AC) bias on the wafer support interferes with the AC flowing in the heating coil, leading to unstable AC bias and uneven film thickness.
Innovation Solution
A wafer support with an insulating-and-heat-conducting unit positioned between the heating unit and the conduct portion to electrically insulate the heating coil and conduct portion, preventing AC interference and allowing for stable AC bias formation, while maintaining heat transfer to the wafer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the heating coil and conduct portion are electrically connected, then heat transfer efficiency is improved, but electrical interference occurs between AC in heating coil and AC bias in conduct portion
Solution Approach 1:
An insulating-and-heat-conducting unit is introduced as an intermediary component between the heating coil and conduct portion. This unit has high thermal conductivity to efficiently transfer heat from the heating coil to the conduct portion, while simultaneously having high electrical insulation properties to prevent AC interference. The unit acts as a mediator that decouples the electrical connection while maintaining thermal coupling, thus resolving the contradiction between heat transfer efficiency and electrical interference prevention.
2Manufacturing precision
If AC bias is applied on wafer support, then thin film uniformity is improved, but AC bias becomes unstable due to interference from heating coil
Solution Approach 1:
The insulating-and-heat-conducting unit serves as an electrical barrier that isolates the conduct portion from the heating coil's AC interference. This allows the AC bias to be stably applied on the conduct portion without being affected by the heating coil's alternating current, thereby maintaining both AC bias stability and thin film uniformity simultaneously.
3Reliability
If heating coil and conduct portion are electrically isolated, then AC bias stability is improved, but heat transfer efficiency decreases
Solution Approach 1:
The insulating-and-heat-conducting unit is made of composite material or material with special properties that combine high thermal conductivity with high electrical insulation. Materials such as aluminum oxide ceramic or other thermally conductive ceramics are used, which have thermal conductivity comparable to metals but electrical insulation properties similar to non-conductors. This composite material property allows simultaneous achievement of AC bias stability through electrical isolation and heat transfer efficiency through thermal conduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures a stable AC bias on the wafer support, resulting in an evenly distributed thin film thickness and improved deposition quality.
Implementation Method 1
the insulating-and-heat-conducting unit is positioned between the heating unit and the conduct portion to electrically insulate the heating coil and conduct portion... the heating unit still can transfer the heat energy to the conduct portion through the insulating-and-heat-conducting unit
Implementation Method 2
it is commonly required to apply an alternating-current (AC) bias on the wafer support, then to heat up the wafer support via a heating coil
Implementation Method 3
the ionized noble gas is attracted by the bias applied on the target material to blast the target material. And then atoms or molecules flying out from the target material are attracted by the bias on the wafer support, and deposited on a surface of the heated wafer
Implementation Method 4
The noble gas within the chamber is ionized by an effect of high-voltage electric field
Data Source
AI summary
The present disclosure is a wafer support, which includes a heating unit, an insulating-and-heat-conducting unit and a conduct portion, wherein the insulating-and-heat-conducting unit is positioned between the conduct portion and the heating unit. During a deposition process, an AC bias is formed on the conduct portion to attract a plasma disposed thereabove. The heating unit includes at least one heating coil, wherein the heating coil heats the wafer supported by the wafer support via the insulating-and-heat-conducting unit and the conduct portion. The insulating-and-heat-conducting unit electrically insulates the heating unit and the conduct portion to prevent the AC flowing in the heating coil and the AC bias on the conduct portion from conducting each other, so the wafer support can generate a stable AC bias and temperature to facilitate forming an evenly-distributed thin film on the wafer supported by the wafer support.