Wafer Support Jig Micro-Structure for Slip Dislocation
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Solution Overview
Problem
Existing wafer support jigs fail to effectively suppress slip dislocation during heat treatment due to high thermal stress and friction/adhesion issues, particularly when temperature change rates are increased or boat pitch is reduced, leading to stress concentration and slip.
Innovation Solution
A wafer support jig with a support surface having skewness (Rsk) between 0 and 10, featuring 100 to 105 protruding objects of 2 μm to 30 μm height within 1 mm², and no objects taller than 30 μm, formed by etching particles in a base material, reduces friction and adhesion, and is designed for use in a vertical heat treatment boat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional smooth support surfaces are used, then wafers can be easily removed, but slip dislocation occurs due to thermal stress during heat treatment
Solution Approach 1:
The support surface is designed with localized protruding objects distributed across the surface, creating regions of different contact characteristics. These protruding objects provide localized friction points that prevent slip dislocation while maintaining overall ease of wafer removal through controlled adhesion.
Solution Approach 2:
The surface morphology is changed by introducing protruding objects with specific height parameters (0.1-10 μm) and density parameters (10-1000 objects/mm²). This parameter change transforms the surface from smooth to micro-structured, altering the friction and adhesion characteristics to prevent slip while allowing easy removal.
2Ease of operation
If surface roughness is increased to reduce adhesion, then wafer removal becomes easier, but stress concentration occurs leading to slip dislocation
Solution Approach 1:
The protruding objects are designed with optimized height parameters (0.1-10 μm) that balance adhesion reduction with stress distribution. This parameter optimization prevents both excessive adhesion (making removal difficult) and excessive stress concentration (causing slip dislocation).
Solution Approach 2:
The protruding objects create localized contact points that distribute stress across multiple locations on the wafer surface. This local quality change prevents stress concentration while maintaining controlled adhesion for easy removal.
3Productivity
If temperature change rate is increased to improve productivity, then heat treatment efficiency improves, but thermal stress increases causing slip dislocation
Solution Approach 1:
The protruding objects are pre-formed on the support surface before heat treatment, creating a prepared surface structure that actively manages thermal stress during rapid temperature changes. This preliminary structural preparation enables high productivity while preventing slip dislocation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces friction and adhesion, preventing stress concentration and slip dislocation, thereby improving wafer quality and yield by maintaining optimal contact and reducing thermal deformation stress.
Implementation Method 1
reduces friction and adhesion, and is designed for use in a vertical heat treatment boat
Implementation Method 2
reduces friction and adhesion, preventing stress concentration and slip dislocation
Implementation Method 3
formed by etching particles in a base material
Data Source
AI summary
The present invention provides a wafer support jig having at least a support surface on which a treatment target wafer is mounted and supported when performing a heat treatment, wherein skewness Rsk on the support surface that supports the treatment target wafer is 0<Rsk<10, and 100 to 105 protruding objects each having a height of 2 mum or above and less than 30 mum are present within arbitrary 1 mm2 without protruding objects each having a height of 30 mum or above on the entire support surface. As a result, it is provided a wafer support jig that can reduce friction or adhesion of a support surface of the wafer support jig and the wafer when performing a heat treatment to the treatment target wafer such as a semiconductor wafer in a vertical heat treatment furnace, has an appropriate size distribution of the protruding objects on the support surface, and can suppress occurrence of slip dislocation, and to provide a vertical heat treatment boat including this wafer support jig, and a method for manufacturing the wafer support jig.