Wafer Support Jig for Warping Prevention
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Solution Overview
Problem
Thinned semiconductor wafers tend to warp during production due to inadequate prevention methods, as existing technologies do not effectively address warping issues during transfer, storage, and processing.
Innovation Solution
A substrate processing apparatus and method that uses a support jig with support sections to bond a support plate to the inner periphery of a wafer's first surface, opposite to where the support is bonded, and transfers the wafer under reduced pressure using a transfer robot with support pins positioned at specific inner periphery points to prevent warping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a thinned wafer is transferred or stored during production, then the wafer can be processed further, but the wafer tends to warp due to inadequate support
Solution Approach 1:
The support jig divides the wafer support function into multiple discrete support sections arranged in a circular pattern. Each support section independently contacts the wafer at specific radial positions, providing distributed support that prevents warping while allowing the entire wafer to be handled as a single unit during transfer and processing.
2Volume of moving object
If the wafer is thinned to reduce chip size and thickness, then higher integration is achieved, but the wafer becomes more susceptible to warping
Solution Approach 1:
The support jig applies support forces at specific local positions on the wafer surface rather than uniform support across the entire wafer. The support sections are positioned at predetermined radial distances from the center, providing targeted local support that counteracts warping tendencies in thinned wafers without affecting the overall thinning achievement.
3Ease of operation
If conventional support methods are used, then the wafer can be handled, but warping prevention is insufficient
Solution Approach 1:
The support jig acts as an intermediary device between the wafer and the handling system. It provides a mechanical interface that maintains wafer flatness during transfer and processing operations, mediating between the need for easy wafer handling and the requirement for reliable warping prevention through its circular array of support sections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents wafer warping during production by stabilizing the wafer through targeted support and reduced pressure transfer, ensuring precise handling and processing without cracking or deformation.
Implementation Method 1
transferring the wafer supported by the support jig under reduced pressure
Data Source
AI summary
A substrate processing apparatus including a transfer unit for transferring, under reduced pressure, a laminate including a wafer and a support plate which are bonded to each other and supported by use of support pins that supports an inner periphery of a first surface of the wafer, the first surface being opposite to a second surface of the wafer onto which a second surface the support plate is bonded.