Wafer Support Pad with Composite PEEK Silicone Friction Zones
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Solution Overview
Problem
Existing wafer handling systems face challenges in maintaining wafer alignment and preventing slippage during linear and rotational movements due to inadequate support and alignment mechanisms, leading to potential contamination and manufacturing inefficiencies.
Innovation Solution
A wafer support and alignment apparatus featuring a flat portion, an upward protruding alignment lip, and a recessed pocket to receive a pad, which provides enhanced support and alignment, utilizing polymer materials like PEEK or silicone to prevent contamination and adjust friction coefficients for stable wafer transport.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a hard polymer pad with lip is used to support the wafer, then wafer alignment is improved, but the wafer can slip sideways during rapid rotation or linear motion
Solution Approach 1:
The invention applies different material properties to different regions of the pad. The peripheral region uses a hard polymer material (PEEK) with high friction coefficient for alignment, while the central region uses a softer polymer material (silicone) with lower friction coefficient for preventing sideways slip. This local differentiation resolves the contradiction between alignment precision and position stability.
Solution Approach 2:
The wafer pad is constructed as a composite structure combining two different polymer materials: a hard polymer (PEEK) for the peripheral alignment region and a soft polymer (silicone) for the central support region. This composite design allows each material to contribute its specific properties - the hard material provides alignment through the lip structure, while the soft material prevents sideways slip during motion.
2Strength
If a metallic end effector finger is used, then structural strength is improved, but wafer contamination occurs
Solution Approach 1:
The invention introduces a polymer pad as an intermediary layer between the metallic end effector finger and the silicon wafer. This pad serves as a mediator that prevents direct contact between the metal and wafer, thereby eliminating contamination risk while allowing the metallic end effector to maintain its structural strength. The pad acts as a protective interface that transmits mechanical forces without transferring contaminants.
3Object-affected harmful factors
If silicone pads are used to isolate the wafer, then contamination is prevented, but the pads wear out quickly
Solution Approach 1:
The invention divides the pad into two functional regions with different materials: the peripheral region uses hard polymer (PEEK) that is wear-resistant and maintains its structural integrity, while the central region uses silicone that provides contamination protection. This local differentiation allows the pad to achieve both long service life through the hard material and contamination prevention through the soft material.
Solution Approach 2:
The pad is constructed as a composite of hard polymer (PEEK) and soft polymer (silicone) materials. The hard polymer component provides structural strength and wear resistance, extending service life, while the soft silicone component prevents wafer contamination. This composite structure resolves the contradiction between durability and contamination protection.
4Speed
If the end effector is accelerated or decelerated into position, then positioning speed is improved, but the wafer can slip during motion
Solution Approach 1:
The invention applies different friction characteristics to different regions of the pad. The peripheral region uses hard polymer with high friction coefficient to prevent sideways slip during acceleration and deceleration, while the central region uses soft silicone with lower friction coefficient to allow controlled motion. This local differentiation enables the system to maintain position stability during dynamic positioning without sacrificing positioning speed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively keeps silicon wafers aligned and in place during transport, reducing the likelihood of slippage and contamination, while allowing for tunable friction coefficients to manage varying forces, thereby enhancing the reliability and efficiency of semiconductor fabrication processes.
Implementation Method 1
The pad is comprised of a material having a desired coefficient of friction. The pad, when seated, is designed so as not to raise a seated wafer above the alignment lip portion.
Data Source
AI summary
Disclosed is a wafer support and alignment apparatus. The wafer support and alignment apparatus includes a wafer support component adapted to seat, align and support a wafer. The wafer support component includes at least one flat portion to support the wafer, at least one alignment lip portion protruding upward from the at least one flat portion, and at least one recessed pocket carved out of a portion of the at least one base portion. The at least one recessed pocket is adapted to receive at least one pad.