Composite Wafer Support for Plasma Corrosion Resistance
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Solution Overview
Problem
Conventional wafer supports made from fine ceramics like silicon nitride and aluminum nitride are difficult to process and prone to corrosion when exposed to corrosive gases or plasma atmospheres in semiconductor manufacturing, leading to particle generation and faults in the manufacturing process.
Innovation Solution
A wafer support featuring a machinable ceramic base material with a protective layer and a conductive member, where the protective layer is made from materials like aluminum nitride, aluminum oxide, or yttrium oxide, providing enhanced corrosion resistance and reduced particle generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If fine ceramics (silicon nitride, aluminum nitride) are used for wafer support, then corrosion resistance to plasma is improved, but processability deteriorates (difficult to process, cutting speed low, chipping occurs)
Solution Approach 1:
The wafer support is divided into two functional parts: a base material made of machinable ceramic (good processability) and a surface layer made of fine ceramic (good corrosion resistance). This segmentation allows each part to fulfill its specific function without compromise.
Solution Approach 2:
The invention uses a composite structure combining machinable ceramic and fine ceramic materials. The base material uses machinable ceramic for ease of processing, while the surface layer uses fine ceramic for plasma corrosion resistance, creating a composite structure that achieves both properties simultaneously.
2Ease of manufacture
If machinable ceramic is used as base material, then processability is improved, but corrosion resistance to plasma deteriorates (particles easily generated from surface)
Solution Approach 1:
The wafer support is divided into two functional parts: a base material made of machinable ceramic (good processability) and a surface layer made of fine ceramic (good corrosion resistance). This segmentation allows each part to fulfill its specific function without compromise.
Solution Approach 2:
The invention uses a composite structure combining machinable ceramic and fine ceramic materials. The base material uses machinable ceramic for ease of processing, while the surface layer uses fine ceramic for plasma corrosion resistance, creating a composite structure that achieves both properties simultaneously.
3Reliability
If protective layer is added to improve corrosion resistance, then plasma resistance is improved, but device complexity increases
Solution Approach 1:
The protective layer is integrated with the base material through sintering, creating a unified composite structure. This merging approach reduces the need for separate assembly steps and simplifies the overall device structure while maintaining the protective function.
Solution Approach 2:
The invention uses a composite structure combining machinable ceramic and fine ceramic materials. The base material uses machinable ceramic for ease of processing, while the surface layer uses fine ceramic for plasma corrosion resistance, creating a composite structure that achieves both properties simultaneously.
Data Source
AI summary
A wafer support includes a base material including a machinable ceramic, a protective layer covering a surface of the base material, and conductive members and placed at least partially inside the base material. The protective layer includes a material that is less corrodible by plasma than the base material.