Ceramic Wafer Support Plug Layout for Plasma Discharge Suppression
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Solution Overview
Problem
Existing semiconductor manufacturing equipment members experience electrical discharge during wafer processing, particularly in deep etching with high-power plasma, despite conventional discharge suppression techniques.
Innovation Solution
A member for semiconductor manufacturing equipment featuring a ceramic substrate with embedded plugs composed of a dense body, where the plug's upper and lower end surfaces and gas passage dimensions are optimized to minimize discharge, with specific height ratios and fracture toughness enhancements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional plugs are used in gas passage portions, then discharge suppression is achieved, but discharge still occurs during deep etching with high-power plasma
Solution Approach 1:
The plug is designed with a specific geometric configuration where the distance from the upper end opening to the gas passage surface (D1) is controlled to be 0.05 to 0.5 times the distance from the lower end opening to the gas passage surface (D2). This local geometric optimization creates different electrical field distribution characteristics in different regions of the plug, effectively suppressing discharge during high-power plasma processing while maintaining gas flow efficiency.
2Reliability
If the plug geometry is optimized to suppress discharge, then discharge suppression is improved, but gas flow efficiency may be compromised
Solution Approach 1:
The invention optimizes the geometric parameters of the plug, specifically controlling the ratio D1/D2 to be within 0.05 to 0.5. This parameter optimization simultaneously achieves effective discharge suppression and maintains adequate gas flow efficiency by balancing the electrical field distribution and gas flow resistance in the plug structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The optimized plug design effectively suppresses electrical discharge between the wafer and base plate, enhancing discharge suppression beyond conventional methods while maintaining gas flow efficiency.
Implementation Method 1
cooling gas such as helium gas is introduced into the back surface of the wafer through a gas passage portion
Implementation Method 2
it suppresses the discharge because the electrons hit the plug before colliding with other gas molecules
Data Source
AI summary
A member for a semiconductor manufacturing equipment that uses a discharge suppression technology different from conventional ones is provided. A member for a semiconductor manufacturing equipment includes: a ceramic substrate having an upper surface on which a wafer is to be placed and a lower surface; a plug placement hole that vertically penetrates the ceramic substrate; and a plug embedded in the plug placement hole; wherein the plug is composed of a dense body, including an upper end surface exposed on a side of the upper surface, a lower end surface exposed on a side of the lower surface, and a gas passage; and wherein a maximum height D1 in the vertical direction from the upper end opening to a surface of the gas passage, and a maximum height D2 from the lower end opening to the surface of the gas passage satisfies a relationship: D1<D2.