Wafer Support Ring Segmented Contact Design
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Solution Overview
Problem
Semiconductor wafers undergo slip during high-temperature annealing due to gravitational and thermal stresses, which can introduce contaminants and damage, as existing support rings contact the wafers at specific points, leading to increased thermal stresses and potential dislocation nucleation.
Innovation Solution
A method and system involving an arcuate wafer support ring with a central opening and channel, designed to contact the wafer at different locations than subsequent support structures, distributing contact points to prevent slip and reduce thermal stress damage, using a first and second wafer support structure to ensure uniform and varied contact during processing operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a support ring contacts the wafer at specific points, then the wafer is supported during annealing, but slip occurs at the contact points due to gravitational and thermal stresses
Solution Approach 1:
The support ring is segmented into multiple contact regions (first contact region and second contact region) that are positioned at different radial distances from the center. This segmentation allows the wafer to be supported at multiple discrete locations, distributing the support forces and preventing slip at any single contact point while maintaining overall wafer stability during annealing.
2Device complexity
If the support ring contacts the wafer at specific points, then the structure remains simple, but thermal stresses concentrate at contact points leading to dislocation nucleation
Solution Approach 1:
Different regions of the support ring are designed with different contact characteristics. The first contact region and second contact region are positioned at different radial locations and have different geometries, creating localized variations in contact quality. This allows stress to be distributed across multiple regions with different mechanical properties, preventing stress concentration at any single point while maintaining structural simplicity.
Data Source
AI summary
A wafer support ring and a method of using the same are disclosed herein. The support ring supports a wafer during a first processing operation. A top surface of the support ring is in contact with a first plurality of locations on a surface of the wafer during the first processing operation. A second wafer support structure is used to support the wafer during a second processing operation. A top surface of the second wafer support structure is in contact with a second, different plurality of locations on the surface of the wafer during the second processing operation. The wafer support ring may also have an outer lip disposed about an outer periphery of the support ring that has a depth such that it does not form part of the top surface of the support ring.