Wafer Support Sheet With Solidified Resin for Frame-Free Dicing
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Solution Overview
Problem
Existing methods for processing plate-shaped workpieces, such as wafers, are low in productivity due to the need for time-consuming maintenance processes on supporting frames.
Innovation Solution
A method involving supporting a plate-shaped workpiece on a sheet with a liquid resin interposed between, processing the workpiece to divide it into chips, and picking up the chips from the sheet without the need for a reusable frame, using either cutting or laser ablation techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a reusable frame with adhesive tape is used to support the wafer, then the wafer can be supported and processed, but the frame requires time-consuming maintenance processes that reduce productivity
Solution Approach 1:
The patent replaces the reusable frame structure with a disposable sheet that is discarded after a single use. This eliminates the maintenance process entirely while providing sufficient support for the wafer during processing. The sheet is simple, inexpensive, and designed for single-use operation only.
Solution Approach 2:
The invention extracts and removes the frame structure from the support system, retaining only the essential supporting function through the sheet and liquid resin combination. This eliminates the maintenance burden of the frame while preserving the core support capability needed for wafer processing.
2Reliability
If a frame structure is used to support the wafer, then the wafer can be held in position, but the complexity of the support system increases due to the need for frames, adhesive tapes, and maintenance procedures
Solution Approach 1:
The patent removes the complex frame structure and adhesive tape system, replacing them with a simple sheet and liquid resin combination. This extraction eliminates unnecessary components while retaining the essential function of holding the wafer in position during processing.
Solution Approach 2:
The disposable sheet replaces the complex reusable frame system. Although the sheet is simple and inexpensive, it provides adequate support for the specific processing task, eliminating the need for complex maintenance and handling procedures associated with frames.
3Reliability
If adhesive tape is used on the frame to hold the wafer, then the wafer can be supported, but debris and adhesive deposits accumulate on the frame requiring cleaning and maintenance
Solution Approach 1:
The patent replaces the reusable frame with adhesive tape with a disposable sheet. The sheet is discarded after single use, eliminating the accumulation of debris and adhesive deposits that would require cleaning and maintenance of a reusable frame.
Solution Approach 2:
Instead of maintaining and reusing the frame and adhesive tape system, the invention discards the sheet after a single use. This eliminates the maintenance burden of cleaning debris and adhesive deposits from reusable components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Increases productivity by eliminating the need for frame maintenance, thus streamlining the processing workflow.
Implementation Method 1
supporting the plate-shaped workpiece on only the liquid resin that has solidified and the sheet
Implementation Method 2
a laser ablation step of applying a laser beam having a wavelength absorbable by the plate-shaped workpiece to a region to be divided of the plate-shaped workpiece to form grooves in the plate-shaped workpiece by way of laser ablation
Data Source
AI summary
A method of processing a plate-shaped workpiece includes a workpiece supporting step of placing a plate-shaped workpiece on an upper surface of a sheet whose area is larger than that of the plate-shaped workpiece through a liquid resin interposed therebetween and supporting the plate-shaped workpiece on only the liquid resin that has solidified and the sheet, a processing step of processing the plate-shaped workpiece to divide the plate-shaped workpiece into a plurality of chips, and a pick-up step of picking up the chips from the sheet.