Universal Ring Wafer Support With Venting and Grounded Grip
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Solution Overview
Problem
Conventional wafer support technologies face challenges such as outgassing, contamination, electrostatic discharge, and complexity in accommodating diverse wafer sizes and materials, leading to compromised imaging quality and increased maintenance costs in semiconductor fabrication.
Innovation Solution
A universal ring wafer support apparatus with a circular main body, raised sections, elastomer polymer contact materials, and vent holes to minimize outgassing and contamination, while providing robust grounding and adaptable support for various wafer sizes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional wafer support technologies are used, then wafer support function is provided, but outgassing and contamination issues occur compromising imaging quality
Solution Approach 1:
The wafer support apparatus employs a porous structure that allows gases to pass through rather than being trapped and outgassed. The porous material enables vacuum penetration and gas flow through the support structure, preventing contamination of the imaging environment while maintaining structural integrity and wafer support functionality.
Solution Approach 2:
The apparatus creates a controlled environment by allowing vacuum to penetrate through the porous structure, effectively creating an inert atmosphere that prevents outgassing and contamination. The design enables the support structure itself to be permeable to the vacuum environment, eliminating harmful gas releases during imaging operations.
2Reliability
If conventional wafer support structures are used, then wafer support is provided, but electrostatic discharge risks occur
Solution Approach 1:
The conductive adhesive serves as an intermediary element that provides a controlled path for electrostatic discharge. By incorporating conductive material in the adhesive layer between the porous support structure and the wafer, the system safely dissipates electrostatic charges without causing discharge events that could damage sensitive semiconductor devices.
Solution Approach 2:
The apparatus replaces traditional mechanical contact-based support systems with a porous structure combined with conductive adhesive, eliminating the need for direct mechanical contact that could generate or trap electrostatic charges. The conductive adhesive layer provides electrical grounding without mechanical complexity.
3Adaptability or versatility
If conventional wafer support apparatus are used, then support function is provided, but complexity increases in accommodating diverse wafer sizes and materials
Solution Approach 1:
The porous wafer support apparatus is designed with universal applicability, where the porous structure and conductive adhesive combination can accommodate various wafer sizes, shapes, and materials without requiring different support structures. The design provides uniform support and grounding across diverse semiconductor devices through its permeable and conductive properties.
Solution Approach 2:
The apparatus utilizes composite construction combining porous material for structural support and gas permeability with conductive adhesive for electrical grounding. This composite approach enables a single support structure to handle multiple wafer types and sizes while maintaining both mechanical support and electrostatic control functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances imaging accuracy and reliability by minimizing outgassing and contamination, ensuring precise wafer placement and grounding, and reducing maintenance costs through versatile and cost-effective support solutions.
Implementation Method 1
a first outer contact material extending along a top portion of the circular shaped raised section to support a wafer having a first diameter and a second inner contact material extending along a top portion of the circular shaped raised section to support a wafer having a second diameter smaller than the wafer having a first diameter
Implementation Method 2
a plurality of vent holes formed through the main body and configured to surround the circular raised island
Implementation Method 3
the circular shaped raised section including a first outer contact material extending along a top portion thereof to support a wafer having a first diameter and a second inner contact material extending along a top portion thereof to support a wafer having a second diameter smaller than the wafer having a first diameter
Data Source
AI summary
A universal ring wafer support apparatus that includes at least one raised support to securely support different size wafers above and separated from the main body to enable dust particles and other contaminants to flow away from a wafer and through the main body to a back side thereof. The universal ring wafer support apparatus and the at least one raised support are formed of a highly conductive material while a top surface of the at least one raised support includes contact material(s) having a high gripping force to raise, grip and securely support a wafer thereon.