Wafer Surface Chemical Distribution Sensing System
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Solution Overview
Problem
In semiconductor manufacturing, chemical mechanical polishing (CMP) processes leave behind a high density of dust and byproduct particles on the wafer surface, which can lead to defects if not properly cleaned, and existing cleaning methods lack effective control over chemical distribution.
Innovation Solution
A CMP system that includes a polishing apparatus for CMP processes and a roll cleaning apparatus equipped with a rotating roll brush, a fluid supply system, and an array of liquid sensors to detect and adjust the distribution of cleaning fluids on the wafer surface during the cleaning process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a roll cleaning apparatus is used to clean the wafer surface after CMP, then dust and byproduct particles are removed, but the cleaning effectiveness is reduced due to non-uniform fluid distribution on the wafer surface
Solution Approach 1:
The patent employs sensors to detect the actual fluid distribution on the wafer surface during the cleaning process, and this detection information is fed back to the control system which adjusts the fluid supply in real-time to achieve uniform distribution, thereby resolving the cleaning uniformity issue
Solution Approach 2:
The system dynamically adjusts fluid supply parameters (flow rate, distribution pattern) based on detected wafer surface conditions and fluid distribution measurements, changing these parameters in real-time to optimize cleaning effectiveness and uniformity
2Area of stationary object
If fluid supply is increased to improve cleaning coverage, then more areas are covered, but fluid distribution becomes less uniform across the wafer surface
Solution Approach 1:
The fluid supply system transitions from a static configuration to a dynamic one where the fluid distribution pattern and flow rates are continuously adjusted based on real-time sensor feedback, allowing the system to maintain both wide coverage and uniform distribution
Solution Approach 2:
The system applies different fluid flow rates and distribution characteristics to different regions of the wafer surface based on local requirements detected by the sensor array, ensuring each area receives appropriate fluid quantity for optimal cleaning
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system ensures a uniform and effective cleaning process by measuring and adjusting the fluid distribution on the wafer surface, thereby reducing defects and improving the quality of semiconductor devices.
Implementation Method 1
a roll brush unit configured to provide a wafer cleaning process
Implementation Method 2
brushing the surface of the wafer with rotating roll brush
Implementation Method 3
an array of liquid sensors configured to detect a distribution of the fluid on the surface of the wafer
Data Source
AI summary
A method includes performing a chemical mechanical polishing (CMP) process on a wafer in a CMP apparatus, loading the wafer into a roll cleaning apparatus after performing the CMP process on the wafer, applying a fluid on a surface of the wafer; brushing the surface of the wafer with a rotating roll brush, and measuring a distribution of the fluid on the surface of the wafer while brushing the surface of the wafer.