Concurrent Wafer Surface and Edge Inspection System
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Solution Overview
Problem
Current semiconductor wafer inspection systems are inefficient in inspecting the edge area, which is crucial for yield improvement, as they are time-consuming and require numerous standard samples, leading to decreased throughput in manufacturing.
Innovation Solution
Integration of a surface and edge inspection system within an equipment front-end module (EFEM) using a combination of bright field and dark field imaging, with an edge inspection tool capable of performing inspections concurrently with surface inspections, and a method to modify inspection recipes based on edge defect patterns to identify at-risk areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual microscope inspection of wafer edge is performed, then inspection completeness is improved, but inspection time increases and throughput decreases
Solution Approach 1:
The patent combines surface inspection and edge inspection into a single integrated inspection system. The inspection tool can simultaneously inspect both the front surface and edge of semiconductor wafers using coordinated optical systems, eliminating the need for separate manual edge inspection steps and thereby maintaining high throughput while ensuring complete inspection coverage
Solution Approach 2:
The inspection system is designed with multi-functionality to perform both surface inspection and edge inspection using a unified platform. The system can inspect various defect types on both surface and edge regions, reducing the need for multiple specialized tools and increasing overall inspection efficiency and throughput
2Measurement precision
If numerous standard samples are used for edge inspection, then inspection accuracy is improved, but manufacturing cost increases
Solution Approach 1:
The system uses the wafer itself as the inspection object without requiring separate standard samples for calibration and measurement. The inspection tool can directly measure edge defects on production wafers using built-in reference features and real-time calibration, eliminating the need for extensive standard sample libraries and reducing material costs
Solution Approach 2:
The system creates digital copies and models of edge features for inspection and analysis. Instead of physically handling numerous standard samples, the system uses optical imaging to capture and analyze edge characteristics, creating virtual reference data that reduces the physical quantity of standard samples needed while maintaining inspection accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the need for extensive sampling, increases throughput, and decreases the cost of ownership in semiconductor manufacturing by enabling simultaneous and efficient inspection of both surface and edge defects, thereby improving yield.
Implementation Method 1
direct a beam of radiation on the surface of the semiconductor wafers, then collect and analyze light reflected and/or scattered from the surface
Implementation Method 2
direct a beam of radiation on the surface of the semiconductor wafers, then collect and analyze light reflected and/or scattered from the surface
Data Source
AI summary
A surface and edge inspection system and the method for inspecting a substrate are disclosed. An edge inspection tool performs edge inspection of one or more substrates while a surface inspection tool performs surface inspection of a different substrate. A recipe for the surface inspection may be modified based on the results of the edge inspection.