Wafer Swapper Using Dual-Blade Concurrent Transfer
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Solution Overview
Problem
Conventional substrate transfer systems in semiconductor processing have limitations such as large footprint, reduced throughput, and particle generation, particularly in cluster and linear arrangements, which hinder efficient substrate handling between process chambers.
Innovation Solution
A substrate transfer system employing at least two blades for concurrent transfer between processing chambers, utilizing a transfer chamber system with slide assemblies, stepper motors, and servo motors to enable simultaneous movement of substrates without the need for intermediate via, reducing the footprint and maintaining a vacuum environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional cluster arrangement with a rotating robot is used for substrate transfer, then substrates can be transferred between process chambers, but the footprint of the central region becomes large and throughput is limited to one or two substrates at a time
Solution Approach 1:
The substrate transfer system is segmented into multiple independent linear conveyors operating in parallel, each capable of transferring substrates independently. This segmentation allows multiple substrates to be transferred simultaneously, increasing throughput while each conveyor maintains a compact footprint.
Solution Approach 2:
The system transitions from a single central rotating robot operating in two dimensions to multiple linear conveyors operating in one dimension but arranged in parallel. This dimensional reorganization allows concurrent substrate transfer without requiring large central space for robot rotation.
2Area of stationary object
If a linear arrangement with a single conveyor is used for substrate transfer, then the footprint is reduced, but the conveyor can only move in one direction at a time which limits throughput
Solution Approach 1:
The transfer system is divided into multiple independent linear conveyors that can operate simultaneously. Each conveyor maintains a compact footprint while the parallel arrangement enables multiple substrates to be transferred at the same time, resolving the contradiction between small footprint and high throughput.
Solution Approach 2:
Multiple conveyors operate continuously and concurrently to transfer substrates, eliminating the idle time that occurs when a single conveyor must reverse direction. This continuous parallel operation maximizes throughput while maintaining a compact footprint.
3Productivity
If conventional robots or conveyors are used for substrate transfer, then substrates can be moved between chambers, but particles are generated and regular maintenance is required
Solution Approach 1:
The linear conveyors are designed as simple, robust mechanisms with fewer moving parts compared to conventional rotating robots. This simplified design reduces particle generation and lowers maintenance requirements, making the conveyors more reliable for continuous substrate transfer.
4Ease of operation
If conventional robots rotate and extend into process chambers for substrate transfer, then substrates can be moved between chambers, but the robot arm interferes with the walls of the central region chamber
Solution Approach 1:
Instead of having a central robot extend outward into process chambers, the system inverts the approach by using linear conveyors that move substrates along a linear path between chambers. This inversion eliminates the need for the transfer mechanism to extend into chamber spaces, avoiding wall interference and reducing central region requirements.
Data Source
AI summary
The present disclosure generally relates to semiconductor process equipment used to transfer semiconductor substrates between process chambers. More specifically, embodiments described herein are related to systems and methods used to transfer, or swap, semiconductor substrates between process chambers using a transport device that employs at least two blades for the concurrent transfer of substrates between processing chambers.


