Wafer Placement Table Cooling Base With Integrated Refrigerant Grooves
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Solution Overview
Problem
The existing wafer placement tables require multiple materials for the cooling base, leading to increased material and manufacturing costs.
Innovation Solution
A wafer placement table design that incorporates a ceramic base with a refrigerant flow channel groove on the cooling base, attached via a seal member to a mounting plate, reducing material types and using a composite material for the cooling base to minimize thermal stress and enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If multiple materials are used for the cooling base (metal substrates with bonding layers), then the structural integrity and thermal conductivity are improved, but the material cost and manufacturing complexity increase
Solution Approach 1:
The patent extracts the refrigerant flow channel function from a separate component and integrates it directly into the cooling base by forming grooves within the cooling base material itself. This eliminates the need for multiple metal substrates and bonding layers, reducing material cost while maintaining the cooling function through the groove structure that guides refrigerant flow.
Solution Approach 2:
The patent employs composite material construction for the cooling base, combining materials that provide both structural integrity and thermal conductivity. The cooling base is designed as a single composite component that integrates structural support and refrigerant flow channel functions, avoiding the need for expensive multi-material assemblies with bonding layers.
2Temperature
If multiple metal substrates are bonded together to form the cooling base, then the thermal conductivity and heat dissipation performance are improved, but the number of material types and bonding processes increase
Solution Approach 1:
The patent merges the structural support function and the heat dissipation function into a single cooling base component. The cooling base is designed as one integrated piece that provides both mechanical support and thermal management, eliminating the need for multiple bonded metal substrates while maintaining effective heat dissipation through its groove structure.
Solution Approach 2:
The patent extracts the refrigerant flow channel function from separate metal substrates and integrates it directly into the cooling base by forming grooves within the cooling base material. This reduces the number of material types from multiple metal substrates to a single cooling base material, simplifying the overall structure.
3Shape
If the refrigerant flow channel is formed by bonding multiple substrates, then the channel structure is established, but the sealing reliability and bonding durability are compromised
Solution Approach 1:
The patent extracts the refrigerant flow channel structure from a multi-substrate bonded assembly and forms it as integral grooves within a single cooling base. This eliminates bonding interfaces entirely, removing the source of potential sealing failures and bonding durability issues while maintaining the necessary channel geometry for refrigerant flow.
Solution Approach 2:
The patent segments the refrigerant flow path into distinct grooves within the cooling base, creating separate channels for refrigerant circulation. This groove segmentation provides reliable sealing by defining clear boundaries within the single cooling base material, eliminating the need for bonding between multiple substrates to create the channel structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces material costs, prevents thermal stress-induced breakage, enhances heat dissipation, and maintains effective refrigerant flow for improved wafer cooling performance.
Implementation Method 1
the refrigerant flow channel groove, and the refrigerant flow channel groove opens at a bottom surface of the cooling base
Implementation Method 2
a refrigerant flow channel groove provided in the cooling base so as to open at a bottom surface of the cooling base
Implementation Method 3
the cooling base may be made of a composite material of metal and ceramics. With such a composite material, it is possible to reduce a difference in coefficient of linear thermal expansion (CTE) between the composite material and a ceramic material that is a component of a ceramic base
Implementation Method 4
the cooling base may be bonded to a bottom surface of the ceramic base via a metal bonding layer. With this configuration, in comparison with the case where the cooling base is bonded to the bottom surface of the ceramic base via a resin (organic) bonding layer, it is possible to efficiently dissipate heat of the wafer placement surface to the cooling base
Data Source
AI summary
A wafer placement table includes a ceramic base having a wafer placement surface on its top surface and incorporating an electrode, a cooling base provided on a bottom surface side of the ceramic base, and a refrigerant flow channel groove provided in the cooling base so as to open at a bottom surface of the cooling base.