Wafer Placement Table Heat Dissipation Sheet Alignment for Thermal Uniformity
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Solution Overview
Problem
Existing wafer placement tables face issues with thermal uniformity due to displacement of the thermally conductive sheet and variations in screw fastening, leading to inconsistent heat distribution.
Innovation Solution
A wafer placement table design featuring a ceramic substrate with projections and a heat dissipation sheet that includes projection insertion holes, allowing for precise positioning and uniform compression, ensuring consistent thermal conductivity across the surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If no positioning device is provided for the heat dissipation sheet, then the structure is simpler, but the heat dissipation sheet may be displaced from its original position during manufacture
Solution Approach 1:
The heat dissipation sheet has insertion holes that automatically align with and receive the projections on the substrates during assembly. The projections serve as self-aligning positioning features that guide the heat dissipation sheet into its correct position without requiring separate positioning devices or complex alignment procedures.
2Strength
If screw members are used to fasten the substrates, then the assembly is secure, but variations in fastening degrees cause thermal non-uniformity
Solution Approach 1:
Projections are pre-formed on the substrates at specific positions and heights before assembly. These projections serve as predetermined positioning and compression reference points that ensure uniform compression of the heat dissipation sheet when the substrates are fastened together, eliminating the need for precise control of screw fastening degrees.
3Manufacturing precision
If the heat dissipation sheet is compressed uniformly, then thermal conductivity is consistent, but positioning accuracy is difficult to achieve
Solution Approach 1:
The insertion holes in the heat dissipation sheet and projections on the substrates form a self-aligning positioning system. During assembly, the projections automatically insert into the corresponding holes, ensuring correct positioning and uniform compression without requiring external positioning devices or complex alignment procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves thermal uniformity by maintaining consistent thermal conductivity and reducing variations in heat distribution, enhancing the efficiency of heat transfer and reducing the likelihood of refrigerant leakage.
Implementation Method 1
The thermally conductive sheet serves a function of transferring the heat of the ceramic substrate to the metal plate
Implementation Method 2
a refrigerant flow path through which a refrigerant flow
Data Source
AI summary
A wafer placement table includes an upper substrate; a lower substrate; a through hole extending through the lower substrate in an up-down direction; a plurality of projections provided in a dot pattern, for example, at an entirety of an upper surface of the lower substrate and being in contact with the lower surface of the upper substrate; a heat dissipation sheet having a projection insertion hole and being disposed between the upper substrate and the lower substrate; a screw hole provided, in the lower surface of the upper substrate, at a position facing the through hole; a screw member inserted from a lower surface of the lower substrate into the through hole and screwed into the screw hole.