Wafer Placement Table Cooling Layout Around Terminal Hole
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Solution Overview
Problem
In conventional wafer placement tables, the power supply terminal hole has a large diameter to accommodate an insulation pipe, which interferes with the refrigerant flow path, leading to poor heat removal at the wafer position above the terminal hole and potentially causing temperature singularities.
Innovation Solution
The wafer placement table design includes a power supply terminal hole that intersects with the refrigerant flow path, eliminating the need to avoid the flow path around the terminal hole, thus preventing temperature singularities. Additionally, an insulation pipe supports the power supply terminal and is fixed to the ceramic substrate with a convex section to regulate its movement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the power supply terminal hole has a large diameter to accommodate the insulation pipe, then the power supply terminal can be properly supported and insulated, but the refrigerant flow path must be avoided around the terminal hole, causing poor heat removal and temperature singularity at the wafer position above the terminal hole
Solution Approach 1:
The power supply terminal hole and refrigerant flow path are merged by making them intersect rather than avoid each other. The refrigerant flow path is routed to pass through the power supply terminal hole, allowing both the power supply terminal to be accommodated and the refrigerant to flow through for effective heat removal, thus eliminating temperature singularity while maintaining terminal support and insulation functionality
Solution Approach 2:
The relationship between the power supply terminal hole and refrigerant flow path is changed from a planar avoidance relationship (2D) to a three-dimensional intersecting relationship. The refrigerant flow path is extended vertically to pass through the hole, utilizing the third dimension to resolve the conflict between terminal accommodation and heat removal requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents temperature singularities at the wafer position above the power supply terminal hole by ensuring uninterrupted refrigerant flow, while also providing insulation and support for the power supply terminal.
Implementation Method 1
a refrigerant flow path is formed
Implementation Method 2
heat removal is worse... temperature singularity (high temperature spot) may occur
Implementation Method 3
electrically insulative liquid may be supplied to the refrigerant flow path... the power supply terminal is insulated from the cooling substrate by electrically insulative liquid
Data Source
AI summary
A wafer placement table includes: a ceramic substrate having a wafer placement surface at an upper surface, and incorporating an electrode; a cooling substrate which is bonded to a lower surface of the ceramic substrate, and in which a refrigerant flow path is formed; a power supply terminal connected to the electrode; and a power supply terminal hole vertically penetrating the cooling substrate and storing the power supply terminal. The power supply terminal hole intersects with the refrigerant flow path.