Wafer Expanding Tape Clamping for Uniform Chip Interval Control
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Solution Overview
Problem
In semiconductor manufacturing, existing methods for expanding the gap between individualized chips after wafer processing are inefficient, often leading to uneven or insufficient expansion, which can result in chip contact during handling and packaging.
Innovation Solution
A semiconductor manufacturing apparatus with clamping portions featuring rotating bodies that pull an expanding tape outward from the center of a wafer, accompanied by a heating unit to maintain the expanded interval, and a control unit for precise adjustment based on detected chip intervals and loads, ensuring uniform and appropriate expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional expanding methods are used to increase chip interval, then chip separation is achieved, but expansion is uneven and insufficient leading to chip contact
Solution Approach 1:
The expanding tape is divided into multiple segments with individual clamping portions, each independently controllable. This segmentation allows different regions of the tape to be expanded to different degrees, achieving uniform overall expansion while preventing chip contact. The clamping portions are positioned at specific intervals to apply localized expansion forces.
Solution Approach 2:
The clamping portions are made rotatable about their respective axes, transforming static expansion into a dynamic process. By controlling the rotation of each clamping portion independently, the system can apply varying expansion forces to different regions, ensuring uniform chip interval expansion while maintaining reliability through adaptive control.
2Length of moving object
If expanding tape is pulled outward from wafer center, then chip interval is expanded, but stress concentration and anisotropic expansion deviations occur
Solution Approach 1:
The expanding tape is divided into multiple segments with individual clamping portions positioned at specific intervals. Each clamping portion applies expansion force independently, distributing stress uniformly across the tape width rather than concentrating it at the center. This segmentation eliminates anisotropic expansion deviations by ensuring symmetric stress distribution.
Solution Approach 2:
Different clamping portions can apply different expansion forces based on local requirements. The system adjusts the rotation and clamping force of each individual clamping portion to achieve uniform overall expansion while minimizing stress concentration at any single location.
3Manufacturing precision
If multiple clamping portions are used to expand tape uniformly, then expansion uniformity improves, but device complexity increases
Solution Approach 1:
Multiple clamping portions perform the same function (expanding the tape) but are independently controllable. This universal design allows the system to achieve uniform expansion across the entire tape width using repeated modular units, balancing complexity with performance through standardization.
Solution Approach 2:
The rotatable clamping portions provide dynamic control capability, allowing each unit to be adjusted independently to achieve uniform expansion. The rotational degree of freedom enables precise control of expansion force and direction, maintaining manufacturing precision while using relatively simple mechanical structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively expands the chip interval uniformly and to a greater extent, reducing the risk of chip contact during handling and maintaining the expanded state, while minimizing stress concentration and anisotropic expansion deviations.
Implementation Method 1
a heating unit to heat the expanding tape in a region between the wafer and the outer peripheral side of the expanding tape in order to reduce stress concentration
Data Source
AI summary
According to one embodiment, a semiconductor manufacturing apparatus includes a plurality of clamping portions and a control unit. Each of the plurality of clamping portions has a first rotating body and a second member. The clamping portions clamp a sheet on which a wafer is mounted. The clamping portions are positioned around an circumferential position of the wafer. The control unit controls rotation of each first rotating body of the plurality of clamping portions to pull the sheet outwardly to increase the distance between individualized chips of the wafer.