Wafer Tape Transfer Using UV Adhesion Release
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Solution Overview
Problem
Existing methods for transferring wafers from one tape to another can damage the wafer during the cutting process of the tape.
Innovation Solution
A method involving a first-frame removing step, a second-frame pressure-bonding step, a pressure-bonding force reducing step, and a peeling step to transfer a wafer from a first tape to a second tape without causing damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the tape affixed to the wafer is cut along the outer circumferential edge of the wafer to transfer the wafer to another tape, then the wafer can be transferred to expose the face side, but the wafer may be damaged during the cutting process
Solution Approach 1:
A release tape is introduced as an intermediary element between the first tape and the wafer. The release tape is affixed to the first tape, and its release liner is peeled off to allow the first tape to be released from the wafer without directly cutting the tape at the wafer's edge. This intermediary approach enables wafer transfer while avoiding direct mechanical contact that could damage the wafer
Solution Approach 2:
The harmful cutting action is extracted and replaced. Instead of cutting the first tape along the wafer's outer circumferential edge, the invention extracts the tape from the system by peeling off the release liner of the release tape, allowing the first tape to be naturally released from the wafer without direct cutting contact
2Strength
If the first tape is firmly pressure-bonded to the wafer to ensure stable handling, then the wafer can be securely transported, but the tape becomes difficult to remove without damaging the wafer
Solution Approach 1:
The release tape serves as a mediator that provides controlled adhesion. It is firmly pressure-bonded to the first tape during transport, ensuring stable handling, but can be easily removed by peeling off its release liner without requiring forceful actions that could damage the wafer
Solution Approach 2:
The adhesion parameters of the release tape are optimized to provide strong bonding during transport (high pressure-bonding strength) but allow easy removal through controlled peeling. The release liner's adhesive properties are designed to change from strongly bonded to easily separable, enabling both secure transport and easy removal
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively transfers wafers from one tape to another without damaging the wafer, ensuring the integrity of the wafer during the transfer process.
Implementation Method 1
the first tape is an ultraviolet-curable tape that is cured upon exposure to ultraviolet rays, and the pressure-bonding force reducing step includes the step of applying ultraviolet rays to the first tape to reduce the pressure-bonding force thereof
Data Source
AI summary
Disclosed herein is a method of transferring a wafer from a first tape that has been pressure-bonded to one surface of the wafer and also to a first frame having an opening with the wafer positioned therein, to a second tape that has been pressure-bonded to a second frame. The method includes a first-frame removing step of detaching the first tape from the first frame by pressing a portion of the first tape that lies between the first frame and the wafer, a second-frame pressure-bonding step of pressure-bonding the second tape pressure-bonded to the second frame to another surface of the wafer, a pressure-bonding force reducing step of reducing a pressure-bonding force of the first tape by imparting an external stimulus to the first tape, and a peeling step of peeling off the first tape from the one surface of the wafer pressure-bonded to the second tape.