Semiconductor Wafer Temperature Control Using Reference Model Servo

The patent applies local quality by assigning different manipulated variable patterns to different control loops based on their individual response characteristics. The slowest control loop receives a pattern that allows it to reach saturation and achieve maximum speed, while other loops receive adjusted patterns that maintain their uniformity. This localized differentiation resolves the contradiction by allowing each zone to operate optimally according to its specific performance characteristics.

The patent changes the parameter of manipulated variable patterns for each control loop based on their response speeds. By identifying the slowest loop and setting its pattern to achieve 100% manipulated variable, then adjusting other loops' patterns accordingly, the system transforms the uniform control approach into a differentiated one that maintains both speed and uniformity through parameter optimization.

The patent applies local quality by creating differentiated manipulated variable patterns for each control loop based on their response characteristics. The slowest loop is assigned a pattern that achieves maximum speed with 100% manipulated variable, while other loops receive adjusted patterns. This localized differentiation allows each loop to follow the reference model appropriately while maintaining overall uniformity, resolving the contradiction between response time and control variable uniformity.

The patent applies dynamics by making the manipulated variable patterns adaptive to each control loop's response characteristics. Rather than using a single static pattern for all loops, the system dynamically adjusts the patterns based on identified response speeds, allowing the system to achieve both fast response time and maintained uniformity through flexible, condition-based control strategies.