Wafer Temperature Measurement Tool Gravity Contact
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Solution Overview
Problem
Current methods for measuring wafer surface temperature during semiconductor reliability tests are either expensive or inconsistent, failing to provide accurate and uniform temperature control across the wafer due to variability in manual force application and high costs associated with commercially made silicon calibration wafers.
Innovation Solution
A wafer temperature measurement tool featuring a calibrated weight and ceramic foot with a temperature sensor that uses gravity to maintain a consistent force contact with the wafer, allowing for accurate and repeatable temperature readings across the wafer surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a temperature measurement tool is placed on the wafer, then temperature readings are obtained, but the contact force between the tool and wafer varies leading to inconsistent measurements
Solution Approach 1:
The tool uses its own weight (calibrated weight) to apply consistent contact force to the wafer surface through the ceramic foot, eliminating the need for manual force application. The gravity-driven mechanism ensures repeatable measurement pressure without operator intervention.
Solution Approach 2:
The calibrated weight provides a specific, controlled force parameter that ensures consistent contact between the temperature sensor and wafer surface. By standardizing the contact force through the weight-ceramic foot assembly, measurement precision is improved.
2Measurement precision
If commercially made silicon calibration wafers are used for temperature measurement, then temperature data is obtained, but the cost is high
Solution Approach 1:
The tool uses a simple ceramic foot and calibrated weight assembly instead of expensive silicon calibration wafers. This low-cost alternative achieves the same measurement function without the high material costs associated with commercial silicon wafers.
Solution Approach 2:
The tool replicates the measurement function of expensive silicon calibration wafers using a simpler, cheaper mechanism consisting of a calibrated weight, ceramic foot, and temperature sensor, achieving comparable accuracy at lower cost.
3Reliability
If manual placement of temperature sensor on wafer is performed, then temperature readings are obtained, but variability in contact force leads to measurement inconsistency
Solution Approach 1:
The calibrated weight automatically applies consistent force to the wafer through the ceramic foot, making the measurement process self-regulating and eliminating operator variability. The tool serves itself by using gravity to maintain constant contact pressure.
Solution Approach 2:
The manual mechanical action of pressing the sensor against the wafer is replaced with a gravity-driven mechanical system where the calibrated weight and ceramic foot assembly automatically applies consistent force, improving reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The tool provides reliable, accurate, and consistent temperature measurements, enabling effective temperature calibration and uniformity across the wafer, reducing costs and variability compared to existing methods.
Implementation Method 1
Gravity is then allowed to pull down the ceramic foot such that the temperature sensor thermally contacts the wafer
Implementation Method 2
the temperature sensor thermally contacts the wafer
Data Source
AI summary
A wafer temperature measurement tool for measuring the surface temperature of a semiconductor wafer. The tool can be used to measure temperature on different parts of the wafer to provide a high resolution temperature distribution map. The tool includes an internal calibrated weight that is slidably disposed within a tool body. A temperature sensor is attached to the bottom of the weight. Ceramic stands are attached to the bottom of the tool body. Gravity pulls down on the weight such that the temperature sensor contacts the wafer when the ceramic stands of the tool body are placed on the wafer.