Wafer Temperature Sensor Feedback Compensation for Heating Zones
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Solution Overview
Problem
Conventional process measurement methods using wafer-type temperature sensors in semiconductor and display device manufacturing are time-consuming and operator-dependent, requiring repeated measurements and manual offset calculations, which vary based on operator skill and experience.
Innovation Solution
A computing device-based process measurement method that receives sensed values from wafer-type temperature sensors, generates temperature values for multiple heating zones, determines compensation values based on differences between measured and target temperatures, and continuously adjusts these values to achieve a stable temperature distribution without the need for manual data output and re-measurement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If manual offset calculation and repeated measurement method is used, then temperature distribution can be adjusted to match desired distribution, but operating time increases and productivity decreases
Solution Approach 1:
The system implements automated feedback control by continuously measuring temperature distribution with the wafer-type sensor, comparing it to the desired distribution, calculating offset adjustments, and applying compensation values automatically. This closed-loop feedback mechanism eliminates manual intervention while maintaining precise temperature control, thereby increasing productivity without sacrificing manufacturing precision.
Solution Approach 2:
The measurement and control system performs self-adjustment through automated offset calculation and compensation. The system measures its own temperature distribution, calculates the required offsets independently, and applies corrections without external operator intervention. This self-service capability reduces operating time and increases production output while maintaining the desired temperature distribution accuracy.
2Manufacturing precision
If manual offset determination by operator is used, then temperature distribution can be adjusted, but operating time varies based on operator skill and experience
Solution Approach 1:
The system replaces the manual mechanical process of operator-based offset determination with an automated computational system. The computing device automatically calculates offsets based on measured temperature distributions and desired targets, eliminating variability introduced by different operator skills and experiences. This substitution consistently reduces operating time while maintaining or improving temperature distribution accuracy.
Solution Approach 2:
The system dynamically adjusts temperature compensation parameters (offsets) based on real-time measurements and desired target distributions. By automatically calculating and applying parameter changes rather than relying on manual operator adjustment, the system eliminates time variability associated with different operator skill levels while achieving consistent manufacturing precision.
3Manufacturing precision
If repeated measurement and adjustment cycles are performed, then desired temperature distribution is achieved, but measurement and data output time increases
Solution Approach 1:
The system merges the measurement, data processing, offset calculation, and compensation application functions into a single integrated automated workflow. The wafer-type sensor remains in the bake unit throughout the process, and the computing device handles all subsequent operations electronically without requiring physical sensor removal or manual data transcription. This merging eliminates redundant time-consuming steps while maintaining the iterative measurement-adjustment cycles needed for manufacturing precision.
Solution Approach 2:
The system maintains continuous operation by keeping the wafer-type temperature sensor in place within the bake unit throughout the entire measurement and adjustment process. Data is continuously collected, processed, and used for offset calculations without interruption or removal of the sensor. This continuity eliminates idle time between measurement cycles and data output operations, reducing total measurement time while achieving the desired temperature distribution accuracy through persistent iterative adjustment.
Data Source
AI summary
A process measurement apparatus and method capable of increasing production by decreasing an operating time are provided. The process measurement method is performed by a computing device, and includes receiving a plurality of sensed values from a plurality of sensors disposed in a wafer-type temperature sensor, generating a first temperature value of a first heating zone based on the plurality of sensed values, and determining a first compensation value based on a first difference value corresponding to a difference between the first temperature value and a target value, wherein a first compensation ratio between the first difference value and the first compensation value when the first difference value is a first value is different from a second compensation ratio between the first difference value and the first compensation value when the first difference value is a second value.