Wafer Temperature Control Structure for Top Plate Flatness
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing temperature control devices for semiconductor manufacturing, which use Peltier modules, face challenges in maintaining the flatness of the top plate due to deformation caused by heat and pressure differences, leading to impaired wafer processing.
Innovation Solution
A temperature control device design that includes a top plate, a Peltier member, a cooling plate, a cover plate, and a pressure reducing device, where the top plate and cooling plate are not in contact, and a seal member ensures airtightness between the top plate and cover plate, reducing pressure and deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the top plate and cooling plate are coupled together to form an airtight space, then the device can maintain pressure differential, but the top plate may still be affected and deformed or distorted due to heat and pressure
Solution Approach 1:
The device is divided into separate components: the top plate assembly and the cooling plate assembly are positioned independently within the airtight space rather than being directly coupled. This segmentation allows each component to maintain its structural integrity independently while still functioning together as a system.
Solution Approach 2:
The airtight space acts as an intermediary medium between the top plate and cooling plate. By introducing this intermediate space, the direct mechanical coupling is eliminated, preventing stress and deformation transmission from the cooling plate to the top plate while still allowing the system to maintain pressure differential.
2Stress or pressure
If air is sucked from the space housing the Peltier module to reduce pressure difference, then the top plate deformation due to pressure is reduced, but the cooling plate may still deform due to heat and the top plate remains at risk of deformation
Solution Approach 1:
The top plate and cooling plate are positioned as separate, non-contacting components within the pressure-controlled space. This spatial segmentation ensures that even when pressure differential is reduced, neither plate directly transmits stress to the other, maintaining top plate flatness.
Solution Approach 2:
The airtight space containing reduced pressure acts as an intermediary environment that isolates both plates from each other. This intermediate space prevents direct mechanical coupling while allowing the pressure reduction to benefit both components simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses deformation of the top plate, maintaining its flatness and ensuring stable wafer processing by reducing pressure differences and preventing stress transfer from the cooling plate.
Implementation Method 1
a Peltier member that is disposed in contact with the top plate from the direction of the axis
Implementation Method 2
a pressure reducing device which reduces the pressure within the accommodation space
Data Source
AI summary
A temperature control device of the present invention includes: a top plate which is formed in a disk shape centered on an axis and has a placement surface for placing an object thereon; a Peltier member that is disposed in contact with the top plate from the direction of the axis; a cooling plate which is disposed on the Peltier member on the side opposite to the top plate in the direction of the axis to come into contact with the Peltier member and allows a refrigerant to flow therein; a cover plate which forms an accommodation space accommodating the Peltier member and the cooling plate between the top plate and the cover plate; and a pressure reducing device which reduces the pressure within the accommodation space, wherein the top plate and the cooling plate are not in contact with each other.