Wafer Temperature Measurement with Remote Processor Heat Isolation

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Solution Overview

Problem

Existing temperature measurement techniques for wafers during high-temperature heat treatment are unreliable due to the breakdown of memory components in temperature measurement wafers exposed to high-temperature environments, rendering them unable to store and provide accurate temperature data.

Innovation Solution

A temperature measurement unit comprising a measurement substrate with temperature sensors, an information processor for acquiring sensor data, and a cable that allows the information processor to be installed separately from the heating area, ensuring it remains out of the high-temperature zone and preventing component damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the information processor is installed inside the heating area to directly measure temperature, then measurement precision is improved, but the memory components break down due to high temperature exposure

Engineering Contradiction:

Improvetemperature measurement accuracyVSAvoidcomponent functionality

Core Design Contradiction:

Measurement precisionVSReliability

Solution Approach 1:

The measurement system is divided into two separate parts: the measurement substrate (wafer with temperature sensor) that enters the heating area, and the information processor that remains in the cooling area. This segmentation allows the sensor to be exposed to high temperature for accurate measurement while the processor is protected from thermal damage.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A cable serves as an intermediary connection between the measurement substrate in the heating area and the information processor in the cooling area. This intermediary enables data transmission across the thermal boundary without direct exposure of the processor to high temperature.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If the information processor is kept outside the heating area to prevent damage, then component reliability is improved, but the ability to directly acquire temperature data deteriorates

Engineering Contradiction:

Improvecomponent functionalityVSAvoidtemperature data acquisition

Core Design Contradiction:

ReliabilityVSLoss of information

Solution Approach 1:

The cable acts as an intermediary data transmission channel, carrying temperature measurement data from the measurement substrate in the heating area to the information processor in the cooling area, enabling reliable data acquisition without direct processor exposure.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The system replaces direct physical presence of the processor in the heating area with a remote measurement substrate connected via cable. This substitution allows the processor to remain in a safe thermal environment while still acquiring temperature information.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables reliable temperature measurement of wafers during high-temperature heat treatment by preventing the information processor from being exposed to high temperatures, thus maintaining its functionality and allowing for accurate temperature data acquisition.

Implementation Method 1

the cable is configured to be able to follow movement of the measurement substrate when a cooling plate on which the measurement substrate is placed is moved from the cooling area to the heating area

Methodology Applied

Scientific EffectCable flexibility and movement following:

Implementation Method 2

a cooling plate on which the measurement substrate is placed is moved from the cooling area to the heating area

Methodology Applied

Scientific EffectMechanical transport:

Implementation Method 3

a sensor configured to measure a temperature... acquire a result of detection by the sensor

Methodology Applied

Scientific EffectTemperature sensing:

Data Source

PatentUS20250046630A1Temperature measurement unit and heat treatment apparatus

Publication Date: 2025.02.06 TOKYO ELECTRON LTD

AI summary

A temperature measurement unit includes a measurement substrate on which a sensor configured to measure a temperature is mounted, an information processor configured to acquire a result of detection by the sensor, and a cable connecting the sensor and the information processor to each other. The information processor is configured to be detachably installed on an installation part facing a heating area provided with a hot plate, with a cooling area interposed therebetween. The cable is configured to be able to follow movement of the measurement substrate when a cooling plate on which the measurement substrate is placed is moved from the cooling area to the heating area and the measurement substrate is placed on the hot plate in a state in which the information processor is installed on the installation part.