Wafer Temperature Control Using Infrared Feedback and Sliding Mode
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Solution Overview
Problem
Existing temperature control systems for semiconductor wafers during electrical characteristic inspections lack high accuracy and speed in feedback control, particularly when dealing with severe heat emission disturbances from high-integration electronic devices.
Innovation Solution
A temperature control device incorporating a heating mechanism with LEDs, a cooling mechanism using a chiller unit and high-speed valve, and a sliding mode control system with an infrared sensor for precise feedback control, allowing for rapid and accurate temperature adjustments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional temperature control systems are used for semiconductor wafers during electrical characteristic inspections, then the system structure is simple, but the feedback control accuracy and speed are insufficient when dealing with severe heat emission disturbances
Solution Approach 1:
The patent implements a feedback control system that continuously monitors the wafer temperature during inspection and adjusts the heating/cooling mechanisms in real-time. Temperature sensors measure the actual temperature, and the controller modifies the thermal input based on the difference between measured and target temperatures, enabling high-accuracy control despite heat emission disturbances from high-integration electronic devices.
Solution Approach 2:
The patent replaces conventional contact-based temperature measurement methods with non-contact infrared temperature detection. This substitution allows for rapid, high-speed temperature measurement without mechanical contact, achieving both high measurement precision and high response speed while maintaining relatively simple system structure.
2Speed
If conventional temperature control systems are used for semiconductor wafers during electrical characteristic inspections, then the device structure is simple, but the feedback control speed is insufficient when dealing with severe heat emission disturbances
Solution Approach 1:
The patent implements a feedback control system that continuously monitors the wafer temperature during inspection and adjusts the heating/cooling mechanisms in real-time. Temperature sensors measure the actual temperature, and the controller modifies the thermal input based on the difference between measured and target temperatures, enabling high-accuracy control despite heat emission disturbances from high-integration electronic devices.
Solution Approach 2:
The patent replaces conventional contact-based temperature measurement methods with non-contact infrared temperature detection. This substitution allows for rapid, high-speed temperature measurement without mechanical contact, achieving both high measurement precision and high response speed while maintaining relatively simple system structure.
3Reliability
If conventional temperature control methods are used, then the system is easy to operate, but the system cannot effectively manage severe heat emission disturbances from high-integration electronic devices
Solution Approach 1:
The patent implements a feedback control system that continuously monitors the wafer temperature during inspection and adjusts the heating/cooling mechanisms in real-time. Temperature sensors measure the actual temperature, and the controller modifies the thermal input based on the difference between measured and target temperatures, enabling high-accuracy control despite heat emission disturbances from high-integration electronic devices.
Solution Approach 2:
The temperature control system automatically adjusts itself based on real-time temperature measurements without requiring manual intervention. The controller autonomously manages the heating and cooling mechanisms to maintain the wafer at the target temperature, ensuring reliable operation while keeping the system easy to operate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high-accuracy and high-speed temperature control of semiconductor wafers, effectively managing severe heat emission disturbances during inspections, ensuring the reliability of electronic devices by maintaining precise temperature conditions.
Implementation Method 1
an infrared sensor configured to measure the temperature of the temperature control object
Implementation Method 2
a heating mechanism having a heating source configured to heat the temperature control object
Implementation Method 3
a cooling mechanism having a cooling source configured to cool the temperature control object
Data Source
AI summary
A temperature control device for controlling a temperature of a temperature control object is provided. The temperature control device includes a heating mechanism having a heating source configured to heat the temperature control object, a cooling mechanism having a cooling source configured to cool the temperature control object, an infrared sensor configured to measure the temperature of the temperature control object, and a temperature controller configured to allow a control system including a sliding mode control to control the heating mechanism and the cooling mechanism based on a measurement signal from the infrared sensor and perform a feedback control of the temperature of the temperature control object.