Wafer Liquid Processing Temperature Mapping for Per-Wafer Quality
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Solution Overview
Problem
Existing substrate processing methods cannot accurately measure the temperature of individual product wafers during processing, limiting the ability to determine the effectiveness of the processing result for each wafer.
Innovation Solution
A substrate processing system equipped with temperature sensors to detect the temperature of the central and edge portions of the wafer, generating temperature distribution information based on processing conditions, and determining the processing result's quality using this information.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If temperature measurement is not implemented during liquid processing, then the processing system remains simple and fast, but the ability to assess processing result quality for each wafer is lost
Solution Approach 1:
The patent replaces physical contact temperature measurement methods with non-contact infrared temperature detection. The infrared detector measures wafer temperature remotely during liquid processing, eliminating the need for physical sensors on the wafer surface while achieving accurate temperature mapping. This substitution resolves the contradiction by enabling precise measurement without adding mechanical complexity to the processing system.
Solution Approach 2:
The patent introduces an infrared detector as an intermediary device that indirectly measures wafer temperature through thermal radiation detection. This intermediary approach allows temperature assessment without direct contact or interference with the liquid processing operation, maintaining system simplicity while achieving the measurement capability.
2Reliability
If temperature distribution information is collected for each wafer, then processing quality assessment is improved, but data processing time and computational load increase
Solution Approach 1:
The patent performs temperature distribution measurement during the liquid processing operation itself, rather than as a separate post-processing step. By capturing thermal images concurrently with processing, the system obtains temperature data in real-time without adding post-processing time, thus improving reliability without increasing time loss.
Solution Approach 2:
The patent creates a thermal image copy or map of the wafer temperature distribution, which is a digital representation that can be analyzed without affecting the physical processing. This copying approach allows comprehensive temperature assessment while keeping the actual processing timeline unchanged, as the thermal map is generated from non-contact detection during processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate assessment of each wafer's processing result, allowing for early detection of abnormalities and differences between wafers, processing units, and lots, thereby reducing defective wafer production.
Implementation Method 1
a temperature of a central portion of the substrate and a temperature of an edge portion of the substrate in the liquid processing are detected by using multiple sensors provided in the processing unit
Data Source
AI summary
A substrate processing method includes performing a liquid processing, detecting a temperature, generating temperature distribution information and determining whether a result of the liquid processing is good or bad. The liquid processing is performed on a substrate by using a processing unit. A temperature of a central portion of the substrate and a temperature of an edge portion of the substrate in the liquid processing are detected by using multiple sensors provided in the processing unit. The temperature distribution information indicating an in-surface temperature distribution of the substrate in the liquid processing is generated based on one or more parameter values defining a processing condition for the liquid processing and the temperature of the central portion of the substrate and the temperature of the edge portion of the substrate. Whether the result of the liquid processing is good or bad is determined based on the temperature distribution information.